New SMT Equipment: soldering and problems and with and qfn (12)

New pick and place machine NeoDen4 with Vision System(Cameras),NeoDen Tech

New pick and place machine NeoDen4 with Vision System(Cameras),NeoDen Tech

New Equipment | Prototyping

NeoDen4(TM4120V) with camera, the brand new and long awaited model of NeoDen, is a desktop Pick andPlace machine with vision system.  As a professional PnP machine designer and developer, NeoDen has been doing research in SMT industry from 2010. Ne

NeoDen Tech Co.,Ltd.

Great Precision LED Prodution Pick and Place Machine PCB Mounter PCBA Work NeoDen4 with Internal rails

Great Precision LED Prodution Pick and Place Machine PCB Mounter PCBA Work NeoDen4 with Internal rails

New Equipment | Pick & Place

NeoDen4 is with dual cameras, auto rails, auto electronic feeders and 4 placement heads, which could help to handle 0201, BGA, QFN and 0.8m/1.2m/1.5m LED strip.  NeoDen4 is the best choice to satisfy all demands of high precision, high capacity,   s

NeoDen Tech Co.,Ltd.

Electronics Forum: soldering and problems and with and qfn (11)

Reflow soldering problems and traces under component

Electronics Forum | Mon Jul 18 12:25:30 EDT 2016 | oleksz

Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen

Reflow soldering problems and traces under component

Electronics Forum | Mon Jul 18 12:24:53 EDT 2016 | oleksz

Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen

Industry News: soldering and problems and with and qfn (12)

SMTA International Conference Program Finalized and Registration Now Open

Industry News | 2011-06-24 19:39:13.0

The SMTA is pleased to announce that the program for SMTA International is finalized and available on-line at www.smta.org/smtai and registration is open. The conference will be held at the Fort Worth Convention Center in Fort Worth, TX on October 16-20, 2011. This year's program allows the attendee to choose from 21 courses, 130 technical papers, 4 focused symposia, and numerous free offerings throughout the conference.

Surface Mount Technology Association (SMTA)

Poll Finds Solder Finish, BGA Components and Reflow Soldering Most Challenging for Industry Engineers

Industry News | 2012-01-22 23:16:58.0

More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.

Association Connecting Electronics Industries (IPC)

Technical Library: soldering and problems and with and qfn (10)

Combination of Spray and Soak Improves Cleaning under Bottom Terminations

Technical Library | 2014-10-23 18:10:10.0

The functional reliability of electronic circuits determines the overall reliability of the product in which the final products are used. Market forces including more functionality in smaller components, no-clean lead-free solder technologies, competitive forces and automated assembly create process challenges. Cleanliness under the bottom terminations must be maintained in harsh environments. Residues under components can attract moisture and lead to leakage currents and the potential for electrochemical migration (...) The purpose of this research study is to evaluate innovative spray and soak methods for removing low residue flux residues and thoroughly rinsing under Bottom Termination and Leadless Components

KYZEN Corporation

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish

Technical Library | 2012-10-18 21:58:51.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. In this paper, we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints on the central pad of two different packages – QFN and an Agilent package called TOPS – on PCBs with a Ni/Au surface finish.

Agilent Technologies, Inc.

Express Newsletter: soldering and problems and with and qfn (947)

Minimizing Voiding In QFN Packages Using Solder Preforms

Minimizing Voiding In QFN Packages Using Solder Preforms SMTnet Express July 27, 2012, Subscribers: 25333, Members: Companies: 8933, Users: 33366 Minimizing Voiding In QFN Packages Using Solder Preforms First published in the 2012 IPC APEX EXPO

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish SMTnet Express October 19, 2012, Subscribers: 25598, Members: Companies: 9011, Users: 33828 The Morphology Evolution and Voiding of Solder Joints on QFN

Partner Websites: soldering and problems and with and qfn (5101)

SolderTips: Dealing with the Problems of Soldering Iron Tips Breaking Down - EPTAC

| https://www.eptac.com/soldertips/dealing-with-the-problems-of-soldering-iron-tips-breaking-down/

: Dealing with the Problems of Soldering Iron Tips Breaking Down Question: We are having a problem with soldering tips oxidizing and becoming unusable after a few hours use

Solder Paste and Soldering Equipment Overview - Nordson Product Solutions

Nordson ASYMTEK | https://www.nordson.com/en/products/solder-paste-and-soldering-equipment?con=t&page=6

solder paste yield and print quality. Integra 508.5 Nordson SELECT The Integra® 508.5 is a multi-station selective soldering system designed for high-volume applications with maximum throughput

Nordson ASYMTEK


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