Industry News: soldering and problems and with and qfn (Page 1 of 2)

SMTA International Conference Program Finalized and Registration Now Open

Industry News | 2011-06-24 19:39:13.0

The SMTA is pleased to announce that the program for SMTA International is finalized and available on-line at www.smta.org/smtai and registration is open. The conference will be held at the Fort Worth Convention Center in Fort Worth, TX on October 16-20, 2011. This year's program allows the attendee to choose from 21 courses, 130 technical papers, 4 focused symposia, and numerous free offerings throughout the conference.

Surface Mount Technology Association (SMTA)

Poll Finds Solder Finish, BGA Components and Reflow Soldering Most Challenging for Industry Engineers

Industry News | 2012-01-22 23:16:58.0

More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.

Association Connecting Electronics Industries (IPC)

Guidelines for Design and Assembly Process Implementation for Bottom Termination Components Released by IPC

Industry News | 2011-05-03 22:50:52.0

Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.

Association Connecting Electronics Industries (IPC)

Working with QFNs and QFPs

Industry News | 2018-10-18 09:05:06.0

Working with QFNs and QFPs

Flason Electronic Co.,limited

New Webinar Explores SMT Stencil Aperture Size and its Relationship with Solder Paste Volume

Industry News | 2012-12-03 16:09:15.0

LPKF Laser & Electronics will present the webinar Stencil Aperture Size and Its Impact on the Printing Process Thursday, December 6, 2012 at 11 a.m. PST. The webinar examines the relationship between stencil aperture size and solder paste volume and how the stencil manufacturing process can influence both.

LPKF Laser & Electronics

One Minute to Understand AXI and Utilize It for Free

Industry News | 2019-08-15 07:31:59.0

AXI is short for automated X-ray inspection, it's one of the most commonly used approaches for defect inspection in PCB Assembly.

Elecrow

ACI Technologies Conducts Hands-on Profiling and Solder Reflow Course with KIC Equipment

Industry News | 2016-11-17 19:00:21.0

KIC today announced that ACI Technologies will host a “Profiling and Solder Reflow: Electronics Manufacturing Skills Training” from Nov. 21-22, 2016. The hands-on training will be conducted on KIC’s automated thermal process tools and systems, and will provide personnel with the knowledge and skills necessary to setup and operate a reflow process. Upon completion students will be able to apply their knowledge of reflow soldering techniques by successfully identifying the heat transfer modes and systems for each reflow method covered.

KIC Thermal

Nihon Superior Shanghai to Exhibit at NEPCON China 2012 Implementing Lead-Free Soldering with Cost Reduction and Reliability

Industry News | 2012-03-28 15:59:44.0

Nihon Superior Shanghai Co. Ltd., a subsidiary of Nihon Superior Co. Ltd. will showcase a new and expanded range of products based on its SN100C® silver-free, lead-free solder at the upcoming NEPCON China 2012 exhibition in Shanghai.

Nihon Superior Co., Ltd.

STI and Contributors to Present Results of 2 Research Papers At SMTA International Technical Conference

Industry News | 2019-08-04 20:09:21.0

STI Electronics announces two technical paper presentations in September at the SMTA International Technical Conference (SMTAI).

STI Electronics

Soldering, Coating, Cleaning and PCB Process Failures from the Desk of Bob Willis

Industry News | 2018-03-25 13:21:16.0

The widest selection of online webinars in the industry has added more titles

ASKbobwillis.com

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