Utilise Gold contains an international business directory of suppliers of precious metal materials used in the electronics industry, including contacts, plating salts, pastes, solders, bonding wires and evaporation materials.
Industry Directory | Manufacturer of Assembly Material / Soldering
AIM is a leading global manufacturer of tin-lead and lead-free solder assembly materials for the electronics industry.
New Equipment | Cleaning Agents
VIGON US is a water-based medium specifically developed for the use in ultrasonic, spray-under-immersion and centrifugal cleaning equipment. Based on MPC Technology, VIGON US removes all types of flux residues from electronic assemblies, ceramic hybr
New Equipment | Assembly Services
G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function
Electronics Forum | Tue Jul 11 12:59:26 EDT 2006 | mattkehoe@sipad.com
We are trying to apply solder to boards with 80 microinches of electro plated hard gold. No components involved, just print 63/37 paste and reflow. The results are very poor on some boards, not so bad on others? Pictures at http://www.sipad.net/thick
Electronics Forum | Wed Jul 12 11:26:12 EDT 2006 | flipit
Hi, I believe you have classic gold imbrittlement here. With 80 microinches of gold you are way over the limit. You can try to reflow longer time and at a higher temperature. The gold does not melt into the solder joint. The gold dissolves into
Used SMT Equipment | Pick and Place/Feeders
DEK 03IX automatic solder paste printing machine features advanced up/down k-view vision system, independent control and adjustment of lighting, high-speed moving lens, accurate alignment of PCB PCB and net board. The DEK Horizon 03IX automatic solde
Used SMT Equipment | AOI / Automated Optical Inspection
OMRON AOI VT-RNS2-L Omron AoiVT-RNSⅡ parameters Hardware part LSIZE Image signal input part Camera 3CCD camera Lighting series Ring LED (R.G.B) Image resolution 10, 15, 20um Mechanism part Transmission method Belt transmission method Producti
Industry News | 2014-07-30 12:20:57.0
ZESTRON, will host a free “Assembly, Cleaning, and Reliability” workshop together with Speedline Technologies, Kester and EIS at the Hotel Holiday Inn Crowne Plaza, Guadalajara, Mexico on September 9th.
Industry News | 2016-08-30 16:08:53.0
Seika Machinery will exhibit in Booth #506 at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. Special show floor prices will be offered on the Sawa Handy Cleaner and select McDry products.
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Parts & Supplies | Storage Equipment
Yhw-m928a-00x optical drill inductor for yg100 track waiting plate Yhw-m928a-00x optical drill inductor for yg100 track waiting plate Pcb Rack Pcb Rack, SMT Factory PCB Transport Trolley, ESD PCB Storage Rack PCB Storage Trolley PCB Storage Trol
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
http://www.gpd-global.com Don't miss this video, the contour mapping process maps gantry positions to those of a calibrated glass plate for highest level of accuracy when precision fluid dispensing is required. More Info: http://www.gpd-global.com/
High Speed PCB solder paste printer SMT Automatic Visible PCB Screen Printing machine for PCB Product Line. ASCEN PCB solder paste printer Support glue printing, automatic control improves production efficiency, quality control and saves pr
Training Courses | ON DEMAND | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Events Calendar | Thu Jun 23 23:30:00 EDT 2016 - Thu Jun 23 12:30:00 EDT 2016 | Rolling Meadows, USA
Measuring Solderability Webinar
Events Calendar | Wed Mar 18 00:00:00 EDT 2020 - Wed Mar 18 00:00:00 EDT 2020 | College Park, Maryland USA
CALCE Reliability Science Symposium - Spring 2020
Career Center | Shen Zhen, China | Management,Sales/Marketing
Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe
Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support
Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.
SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk
| https://www.eptac.com/ask/failing-to-remove-gold-plating-in-final-assembly/
. There is no requirement to remove this gold plating prior to soldering. The only requirement for the removal of gold is for component leads and terminals which will be soldered to the printed circuit board itself
">ASYMTEK Products | https://www.nordson.com/en/divisions/efd/products/solder-paste?con=t&page=13
Solder Paste and Flux Soldering Pastes & Products Nordson EFD Nordson EFD Corporate Global Directory Languages Division Only All of Nordson Home Products Accessories
