New SMT Equipment: solderjoint reliability (2)

VT-X750 In-Line Automated X-Ray CT Inspection

VT-X750 In-Line Automated X-Ray CT Inspection

New Equipment | Inspection

High-speed Automated X-ray CT Inspection System The Omron VT-X750 is the perfect solution to manufacturers desiring the highest-speed, in-line, automated 3DCT X-Ray inspection on PCBs containing components such as BGAs or CSPs with hidden solder joi

Omron Inspection Systems

VT-X700 E/L In-Line Automated X-Ray Inspection

VT-X700 E/L In-Line Automated X-Ray Inspection

New Equipment | Inspection

The 3D-CT method enables the inspection of indistinct shapes which 2D or pseudo CT cannot detect. Making the impossible in design a reality! The Omron VT-X700 is the perfect solution to manufacturers desiring high-speed, in-line, automated X-Ray ins

Omron Inspection Systems

Electronics Forum: solderjoint reliability (8)

Lead Free

Electronics Forum | Fri Jan 30 06:20:43 EST 2009 | milas

Hi Does anyone have any thoughts on Lead Free solderjoints reliability in a high vacuum environment ?

PWB strain specs?

Electronics Forum | Wed Jul 30 16:57:23 EDT 2008 | stevek

Folks, I'm looking for some specs for the maximum bend or strain that should be put on a PWB. Not looking at the solderjoints. I'm concerned with localized bending of the fab and what might be a reasonable limit for that bending. I've measured 105

Industry News: solderjoint reliability (3)

IPC APEX EXPO 2015 Programs Highlight Technology and Innovation Registration Now Open

Industry News | 2014-11-17 18:24:17.0

IPC APEX EXPO 2015 technical conference and professional development sessions, which will take place February 22-26 at the San Diego Convention Center in San Diego, California. Registration is now open at www.IPCAPEXEXPO.org.

Association Connecting Electronics Industries (IPC)

Indium Corporation Features InFORMS® at NEPCON Japan

Industry News | 2015-12-13 19:42:23.0

Indium Corporation will feature its reinforced indium and solder alloy fabrications InFORMS® at NEPCON Japan, Jan. 13-15 in Tokyo, Japan.

Indium Corporation

Express Newsletter: solderjoint reliability (531)

Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes

Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes by: Cheryl Tulkoff, Greg


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Inline Cleaning Machine Hydro-clean Array

World Source Equipment: Used equipment sale. Hundreds of items on sale.
PCB AOI

Reflow Soldering 101 Training Course
Dual Lane Reflow Oven

High Precision Fluid Dispensers


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