Some electronic devices require AC signals with high frequency stability, while LC oscillators have poor stability and are prone to frequency drift. In the oscillator using a special element - quartz crystal, can produce a highly stable signal, the u
New Equipment | Cable & Wire Harness Equipment
For over 30 years ACDi has specialized in the manufacture of a wide variety of wiring harnesses, cable assemblies, and chassis units for commercial, industrial, military, and medical applications. ACDi is certified and listed by UL as a “Wiring Harne
Electronics Forum | Tue Mar 25 09:35:28 EDT 2014 | emeto
Have you tried to bake the boards before you process them?
Electronics Forum | Tue Mar 25 10:31:05 EDT 2014 | sara_pcb
The boards are baked for 2 hours at 120 deg C Regards, R.Saravanan
Industry News | 2003-03-11 08:45:00.0
CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.
Industry News | 2003-03-25 08:31:07.0
On completion of the transaction, Flairis will become a wholly-owned subsidiary of Beyonics and its shares will be delisted from Sesdaq.
Parts & Supplies | THT Equipment
PCB MMINT 44024101 THETA MOTOR ASSY 47598202 THETA ENCODER ASSY 47509501 Z MOTOR ASSY 47598201 THETA ENCODER ASSY 44714001 CLUCTH UNITIZED 1.5 49752106/50121207 CLUTCH ASSY 45762701 MIRROR CLUCTH FJ 50121208 MIRROR CLUCTH FJ 50151806 CAP 42342901 HD
Parts & Supplies | Pick and Place/Feeders
Product Description SMT nozzle pick and place machine NXTII H04 1.0 R19-010-155 AA06W07 assembly Place of Origin:China( Mainland ) Brand Name: FUJI Model Number: AA06W07 TYPE: nozzle
Technical Library | 2016-09-08 16:27:49.0
In this investigation a test matrix was completed utilizing 900 electrodes (small circuit board with parallel copper traces on FR-4 with LPI soldermask at 6, 10 and 50 mil spacing): 12 ionic contaminants were applied in five concentrations to three different spaced electrodes with five replicas each (three different bare copper trace spacing / five replications of each with five levels of ionic concentration). The investigation was to assess the electrical response under controlled heat and humidity conditions of the known applied contamination to electrodes, using the IPC SIR (surface insulation resistance) J-STD 001 limits and determine at what level of contamination and spacing the ionic / organic residue has a failing effect on SIR.
Technical Library | 2015-05-21 18:46:31.0
In this work the reliability of an embedded planar capacitor laminate under temperature and voltage stress is investigated. The capacitor laminate consisted of an epoxy-BaTiO3 composite sandwiched between two layers of copper. The test vehicle with the embedded capacitors was subjected to a temperature of 125oC and a voltage bias of 200 V for 1000 hours. Capacitance, dissipation factor, and insulation resistance were monitored in-situ. Failed capacitors exhibited a sharp drop in insulation resistance, indicating avalanche breakdown. The decrease in the capacitance after 1000 hours was no more than 8% for any of the devices monitored. The decrease in the capacitance was attributed to delamination in the embedded capacitor laminate and an increase in the spacing between the copper layers.
This video shows how to use a mouse in CAM350. The GUI is also discussed as well as how to customize it. Custom toolbars and hot keys are demonstrated
Rugged Material Feeding Unit for Highly Abrasive Dispensing Media With High Viscosity. Loading of Material From 20-Litre Drums With the Patented Scheugenpflug Barrel Follower Plate. The barrel (hobbock, pail) is positioned on the ergonomic hobbock d
Training Courses | | | IPC/WHMA-A-620 Specialist (CIS)
The Certified IPC/WHMA-A-620 Specialist (CIS) training focuses on cable and wire harness fabrication and installation.
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic3004&OB=ASC.html
.5mm and below the padstack will always be Soldermask defined? And if it's Soldermask defined, then it will automatically be a Non-Collapsing type therefore should follow the pad oversize rule
| https://www.eptac.com/ask/bubbles-in-conformal-coating/
. In the process of reading your question I would consider the attached statement from the J-STD-001 document. Since the bubble is on top of the soldermask coating and if the bubble was not there would the noncommon conductors be exposed
