Technical Library | 2023-09-05 21:00:53.0
The head on pillow defect is becoming more common. This paper describes one such occurrence for an OEM and explains how it was dealt with. In this particular case it was solved by application of problem solving skills by the OEM, component supplier and the solder paste provider
Technical Library | 2013-01-05 22:21:01.0
More and more countries legislate to forbib lead usage in solder material. However, the lead-free solder wire has higher melting point and soldering temperature, increase soldering iron temperature may damage the PCB or components. How to solve this problem?
Technical Library | 2012-04-05 22:53:10.0
In this paper we show how hybrid control and modeling tech-niques can be put to work for solving a problem of industrial relevance in Surface Mount Technology (SMT) manufacturing. In particular, by closing the loop over the stencil printing process, we ob
Technical Library | 2012-04-09 14:08:18.0
As the electronics assembly industry evolves, printed circuit board (PCB) features and surface mount technology (SMT) components continue to get smaller and smaller. This miniaturization shrinks the process window at print, placement, and reflow, increasi
Technical Library | 2021-09-01 15:26:46.0
The global electronics industry's ability to deliver seemingly limitless ongoing advancements in product capabilities has encouraged an insatiable consumer demand for more, better, and smaller. Demands for high functionality of mobile devices, smart watches, military, medical, audio, and wearable technology continue to drive requirements for miniaturisation.
Technical Library | 2006-12-18 14:55:35.0
Many solder users have preconceived notions and worries involving reflow profiling guidelines. Year after year of reading profiling recommendations in industry publications, from a litany of pundits, has made it clear that perfect profiles exist and should be sought after. They feel if the solder supplier gives them a tidy drawing on a piece of paper with times and temperatures that it will magically solve all their reflow problems. This is, unfortunately, an often incorrect assumption.
Technical Library | 2022-01-12 19:26:19.0
Autonomous vehicles have the potential to revolutionize the automotive industry and are gaining immense attention from academia as well as industry. However, facets of autonomous vehicle systems related to the interconnection of independent components pose vulnerabilities to the system as a whole. These vulnerabilities aren't guaranteed to be solved by traditional security methods. Blockchain technology is a powerful tool that can aid in improving trust and reliability in such systems.
Technical Library | 2007-03-13 14:31:11.0
Do you have an idea for an electronic product, the next must-have gadget, music or video system, time saver, or the greatest problem-solving device that was ever invented? Before you begin designing the product, there are a number of tasks that you must complete and issues that you must resolve before you have an actual product design that can be produced, marketed, and sold. This article will provide you with some guidelines to assist you in getting your idea turned into a successful design. Other issues, such as whether or not to apply for a patent for your product idea and in detail how a particular product should be advertised or marketed will not be addressed in this article.
Technical Library | 2016-11-17 14:58:02.0
Since 2006 RoHS requirements have required lead free solders to take the place of tin-lead solders in electronics. The problem is that in some environments the lead free solders are less reliable than the older tin-lead solders. One of the ways to solve this problem is to corner stake, edge bond or underfill the components. When considering what mitigation technique and material to use, the operating conditions must be characterized. The temperature range is important when selecting a material to use since the glass transition temperature (Tg) and coefficient of thermal expansion (CTE) are important properties. If improperly chosen, the mitigation material can cause more failures than an unmitigated component.
Technical Library | 2017-04-06 16:50:56.0
Silicon photonics is an IC technology where data is transferred using light that is routed on the chip using optical waveguides (Figure 1). Silicon photonics is best known as a method to solve problems with high input/output bandwidth applications. For example, because of ever-growing bandwidth requirements in datacenters, the optical transmit and receive heads are being placed closer and closer to the board and the IC. But, designers also apply this technology to biosensors, medical diagnostics, and environmental monitoring. Regardless of the application, photonic ICs always need integration to electronic circuits and this results in unique challenges.
