We offer tape and reel packaging services for standard or non standard SMD components. We provide as well customized carrier tapes for special components designed at our customers specifications Standard components: DDPAK DPAK SOP PLCC QFP QFN TO25
We supply the following material for tape & reel equipment : Pocket tape Cover tape Reels (all dimensions) We design customized pocket tape for any kind of components Standard components: DDPAK DPAK SOP PLCC QFP QFN TO252 TO263 SO SOS SOT
Electronics Forum | Thu Jul 23 03:15:43 EDT 2015 | padawanlinuxero
So let me get this straight you want the mydata to pick the SOT-23 from the reel tape take it to a part of the y-wagon put the SOT-23 inside the programmer, program the sot-23 have the midas (which is the only one can do something similar) pick up th
Tektronix 370B Programmable Curve Tracer The 370B, the world standard for high-resolution curve tracers, provides up to 20 A/2,000 V sourcing capability combined with 1 pA and 50 micro V measurement resolution. The 370B performs DC parametric c
Industry News | 2003-04-29 08:44:42.0
New technology allows the CAT24C00 to be packaged in a compact, 5-pin SOT23 package that requires 40 percent less printed circuit board area than an MSOP package.
Industry News | 2005-04-28 12:05:17.0
Offer On-Resistance Down to 1.2 Ohms in SC-70 and SOT-23 Packages
Universal GSM 08MPFX small plate nozzle Head Type: Flexjet 07/07+/09 (7-Spindle) Type: Nozzle Nozzle Part #: 48503409 Description: 08MPFX Ceramic Vented Multi-Port Nozzle (FJ) Nozzle Style: Standard Nozzle ID: 08MPFX Nozzle Description: 08MPF
MyData Mycronic For 0603/0805/SOT-23 components.: TYPE: A12, 0.8mm ID (0603, 0805)
Technical Library | 2020-11-04 17:49:45.0
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
4925.00 m 537.50 m 180 TOP C6 0.1uF RLP133 6055.00 m 275.00 m 0 TOP -------------- EXAMPLE #4 - PCB X/Y CENTER & ROTATION FILE ( Fields: ref des=1, xloc=2, yloc=3, rot=4, units=mils ) R18 1730 115 270 r0805 R20 1190 125 0 r0805 R21 175 725 270 r0805 R22 1555 340 0 r0805 U1 790 555 90 so-20w Q1 670 1050 0 sot-23 -------------- EXAMPLE
. "FootEdge4" is for a retangular package like TQFP. The triode model is to improve SOT-23 parts alignment The image parameter is set to triode