New SMT Equipment: sot-23 code (11)

LM431BIM3X/NOPB

LM431BIM3X/NOPB

New Equipment | Components

Manufacturer:TI Package:SOT-23 Date Code:19+ Description:V-Ref Adjustable 2.495V to 37V 100mA 3-Pin SOT-23 T/R http://www.smdmarkingcodes.com/parts/details?id=LM431BIM3X/NOPB

Chongway Electronics Tech Limited

Analog Output NI PCI-6723

Analog Output NI PCI-6723

New Equipment | Industrial Automation

Sales Manager: Sandy Lin Email:  unity@mvme.cn Skype:  onlywnn_1 Mobile(Whatsapp): (+86)-18020776786   XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC,

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

Electronics Forum: sot-23 code (19)

marking code for SMT

Electronics Forum | Wed Mar 22 05:53:10 EST 2000 | tabbakh

Iwould like to know the reference for 2 surface mounted device 1)marking D05 SOT143 2)marking R2 D SOT23 Thank you very much

marking code for SMD

Electronics Forum | Wed Mar 22 05:40:52 EST 2000 | tabbakh

I would like to know the reference of 2 surface mounted device 1)marking D05 SOT143 2)marking R2 D SOT23 Thank you very much

Technical Library: sot-23 code (5)

Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection?

Technical Library | 2020-11-04 17:49:45.0

OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards.

ZESTRON Americas

SMD Nomenclature - in Plain English

Technical Library | 2000-11-13 20:16:17.0

Free 40 page booklet explains about SMD component nomeclature. Lot of drawings. Easy to read. Want to know what 1206 means? Or the difference between a TQFP and LQFP? It's all included.

TopLine Dummy Components

Express Newsletter: sot-23 code (43)

Partner Websites: sot-23 code (417)

130093_Code_of_Conduct_20130917_en_RZ2.indd

| https://www.clariant.com/-/media/Files/Company/Procurement/Code-of-Conduct/Clariant-Code-Of-Conduct-Fair-Play-201304-EN.pdf?la=de

. FAIR, COURTEOUS, AND RESPECTFUL TREATMENT OF EMPLOYEES 22 19. DATA PRIVACY 23 20. IMPLEMENTATION OF THE CODE OF CONDUCT 24 21. VIOLATIONS OF THE CODE OF CONDUCT 25 1. APPLICABILITY 2

Panasonics nozzles

| https://www.qy-smt.com/shop/category/panasonic-smt-nozzles-1154/page/23?order=name+asc

.150 Shasong Road, Baoan, Shenzhen Guangdong (CN) 518104 China PANASONIC SMT Nozzles Prev 20 21 22 23 24 25 26 Next Filters (Clear All) Quick Filter Filters x Show categories PRODUCTS CATEGORY


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