Industry Directory | Manufacturer
We specialize in Flex PCBs, Ridgid Flex, Long Flex PCBs and RF (radio frequency) Boards. Our engineering team has seen it all.
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
New Equipment | Education/Training
This two day course is based on the IPC-7721. Students will learn how to repair surface mount pads, BGA pads, finger contacts, traces, laminate, plated through holes and more. Students will be introduced to the proper techniques for SMT & PTH compon
Electronics Forum | Wed Jun 23 18:23:32 EDT 1999 | Tom B.
Even though you may find a pad-pad thru-hole spacing, part body size, orientation, and insertion head tooling clearences may be the deciding factor in spacing. 1. Part body diameter will dictate component centroid spacing. ---[][][][
Electronics Forum | Wed Jun 23 15:49:30 EDT 1999 | Kelly Morris
In the IPC-SM-782 (Surface Mount Design and Land Pattern Standard) it recommends a minimum of .040" between bottomside wavesoldered chip pads. Where might I find a similar IPC recommendation for minimum space between thru-hole pads? Does anyone kno
Used SMT Equipment | THT Equipment
Spare parts for Universal Radial and Axial through-hole insertion machines Model specifications: (RAD5 6360D, RAD8 6380A, RAD8 XT 6380B, VCD5 6241D, VCD8 6241F, VCD Dual 6292A, SEQ 2596A, SEQ5, SEQ8). UIC Part Number / Part Description 15754 O
Used SMT Equipment | Pick and Place/Feeders
Spare parts for Universal Radial and Axial through-hole insertion machines (RAD5 6360D, RAD8 6380A, RAD8 XT 6380B, VCD5 6241D, VCD8 6241F, VCD Dual 6292A, SEQ 2596A, SEQ5, SEQ8). UIC Part Number / Part Description 15754 O'RING 15755 O'RING 15759
Industry News | 2003-03-26 08:25:40.0
The QVE00033 transmissive switch's small size, surface mount package and performance make it ideal for noncontact switching applications in disk drives, card detectors, mise and trackballs.
Industry News | 2013-01-14 08:41:05.0
OK International will debut the new Metcal MX-5200 Soldering, Desoldering and Rework Series in Booth #735 at the upcoming IPC APEX EXPO
Parts & Supplies | Other Equipment
Through years of efforts,we've developed a wide range of SMT nozzle for various machines including but not limited to FUJI, JUKI, KME, PANASERT, SAMSUNG, SANYO, SONY, TDK, TENRYU, TESCON & YAMAHA. Especially we have developed very high standard pick
Parts & Supplies | Circuit Board Assembly Products
PULANG TECHNOLOGY CO,.LTDOffers electronic manufacturing services including PCB designing, electronic contract manufacturing including electronic product design, electronic product development, electronic product repair, PCB manufacturing, electronic
Technical Library | 2016-02-11 18:26:43.0
Although reflow ovens may not have been dramatically changed during the last decade the reflow process changes step by step. With the introduction of lead-free soldering not only operation temperatures increased, but also the chemistry of the solder paste was modified to meet the higher thermal requirements. Miniaturization is a second factor that impacts the reflow process. The density on the assembly is increasing where solder paste deposit volumes decreases due to smaller pad and component dimensions. Pick and place machines can handle more components and to meet this high through put some SMD lines are equipped with dual lane conveyors, doubling solder paste consumption. With the introduction of pin in paste to solder through hole components contamination of the oven increased due to dripping of the paste.
Technical Library | 2023-05-02 19:03:34.0
The demand for 0201 components in consumer products will increase sharply over the next few years due to the need for miniaturization. It is predicted that over 20 billion 0201 components will be used in more than one billion cell phones worldwide by the year 2003. Therefore, research and development on 0201 assembly is becoming a very hot topic. The first step to achieve a successful assembly process is to obtain a good PCB design for 0201 packages. This paper presents the data and criteria of PCB design for 0201 packages, including the pad design for 0201 components, and the minimum pad spacing or component clearance between 0201 components or between 0201 and other components. A systematic study on pad design and pad spacing was undertaken, using two test vehicles and three Design of Experiments (DOEs). In the first DOE, 2 out of 18 types of 0201 pad designs were selected based on process yield. The second DOE was focused on pad spacing, including 10mil, 8mil, 6mil and 4mil. The third experiment was final optimization, using two types of optimized pad designs with 10mil, 8mil and 6mil pad spacing. Through the above experiments, the design guideline for PCB layout for 0201 packages and the assembly process capability are identified.
I.C.T Provide SMT Production Line solutions with Automated Optical Inspection (AOI) AOI is short for Automated Optical Inspection, which is widely used in the electronics industry to check the appearance of PCBA assembly at the back end of the cir
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
Training Courses | | | IPC-7711/7721 Specialist (CIS) Recert.
The Certified IPC-7711/7721 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC-7711/7721 Specialist.
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Tue Jan 23 00:00:00 EST 2018 - Tue Jan 23 00:00:00 EST 2018 | New Milford, Connecticut USA
FREE Webinar: Eliminate Circuit Board Problems and Failure Modes
Career Center | san diego,, California USA | Engineering,Production,Quality Control,Technical Support
SMT Process Engineer, ISO-9001, IPC-600/610/620/7711/7721, J-STD-001, Thermal profiling, Lean manufacturing.
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
ORION Industries | http://orionindustries.com/pdfs/silpad400.pdf
. Sil-Pad 400 actually improves its thermal resistance with age. The reinforcing fiberglass gives excellent cut-through resistance and Sil-Pad 400 is non-toxic and resists damage from cleaning agents
Blackfox Training Institute, LLC | https://www.blackfox.com/tag/through-hole-soldering-training/
Through Hole Soldering training Archives - Blackfox Skip to content Blackfox Premier Training & Certification +1 (888) 837-9959 Search: Course Calendar Course Calendar 2024 IPC Certification IPC Courses IPC-A-600 IPC 7711/7721 IPC-A-6012 IPC 7711/7721 Recert IPC-A-610 IPC/WHMA-A-620 IPC-A-610 Recert IPC/WHMA-A-620 Recert J-STD-001
