Electronics Forum: speedline and squeegee and blade (Page 1 of 2)

Differences between screen and stencil printing

Electronics Forum | Thu Dec 16 15:00:20 EST 2004 | glaucon

Simple differences. Both processes require a very similar machine platform, controlled motion, vision fiducial recognition and alignment of a substrate (PCB or hybrid ceramic) to the "image", the image being either a stencil (hence stencil printing)

SPI and after market squeegees

Electronics Forum | Tue Nov 25 12:48:31 EST 2014 | cyber_wolf

Has anyone looked at SPI results across different squeegee blade manufacturers ? We are running Momentums and using the MPM pro-blades. Ive been considering looking at permalex blades again to see if I can maybe squeek out some better yields.

paste Sn42/Bi58 and Lead Finish

Electronics Forum | Thu Nov 15 03:07:35 EST 2012 | nikyta

Thanks for your reply. As already said by Anvil1021, is not a good idea to mix Lead and Bismuth! Stay away from Bismuth if you have even the slightest traces of Lead on yours PCB, stencil, squeegee, spatula, blade, cleaning paper or cleaning cloths,

Printer and Reflow Oven Recommendations

Electronics Forum | Fri May 15 21:39:48 EDT 2015 | jlawson

Reflow.. 1.Rehm (Germany) - Best in Class Best overall process stability heating system ( Alot of makers have started to copy there VX heating arrangement ). COnveyor chains can be a bit more attention in terms of maintenance on rehm , but if foll

Solder paste height and metal squeegees

Electronics Forum | Fri Apr 20 16:05:17 EDT 2001 | gcs

We always reduce side to side, EXAMPLE: 12 mil width reduced to .010". Do you guys check viscosity ? Also maybe your guys are appling to much pressure on the sqweegee blades.

Solder paste height and metal squeegees

Electronics Forum | Fri Apr 20 11:05:23 EDT 2001 | gcs

Just a bullet! My results are, .005" stencil thickness should measure between .0055" - .006" if your pressure is correct, metal blades and snap-off is set up correctly. Do you have aperture reductions at the QFP locations "typicial industry standard

Re: Solder Paste and Stencil questions

Electronics Forum | Tue Oct 12 22:22:34 EDT 1999 | se

| Hi, | We are in the process of evaluate our solder paste,incoming inspection over the solder paste, stencil requirments: | | 1- Is anybody using/requiring 1000 Kcps or more on viscosity to your solder paste provider ? Why ?? | 2- Is anybody using

paste release from stencil, and volume calculation

Electronics Forum | Sun Nov 07 10:54:21 EST 1999 | Steve Thomas

We're looking at redesigning our stencils to facilitate better (well, it's pretty much non-existant, so any improvement is a big leap) release from fine pitch apertures. Currently we have perpendicular walled laser cut apertures. We'll be having

Stencil Printing Process Troubleshooting and control

Electronics Forum | Thu Oct 17 17:18:48 EDT 2002 | Leandro G. Barajas

Hi everybody, This is a simple posting to initiate a discussion on different ways to troubleshoot, improve, and control the Stencil Printing Process SPP in SMT manufacturing. There are many SPC, ANOVA and other analysis techniques that provide insi

Pick and Place Startup - LQPF100 bridging issues

Electronics Forum | Thu Apr 29 10:24:15 EDT 2021 | oxygensmd

I have the same issue but with one customer only. All the other have smaller or more difficult QFPs with really low bridging issues - close to no-one. I think the PCB and PCB design also an issue - other customers are using 32/64/100/144 QFPs and we

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