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Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
Presenters: John Bashe, Parmi & Nick Fieldhouse, Omron Overview Instructions & guidelines rules for this Webinar Ohio Valley SMTA Updates Presenter - AOI & SPI technology and the different methods – by Parmi - John Bashe 5 to 10 minute Q & A Presenter - The
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner/bubbles-and-conformal-coating
. Joint Industry Standard IPC J-STD-001F – Requirements for Soldered Electrical and Electronic Assemblies When bubbles or voids are present and do not meet the void criteria, they shall be considered process indicators
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GPD Global | https://www.gpd-global.com/pdf/dispense/Dispensing-Systems-and-Pumps-Overview.pdf
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