Electronics Forum: spill and solder (Page 1 of 108)

wave soldering and solder bridge

Electronics Forum | Mon Dec 17 11:55:08 EST 2007 | chef

I recently had the same problems, solder bridges on every thing I made, different customers boards, etc. I wave with no-clean flux. As I sorted out problems (pin holes, blow holes, splatter, etc.) I found a lot of variable factors. I changed flux,

WSOL and solder pot

Electronics Forum | Wed Mar 12 12:28:52 EDT 2008 | operator

I recently witnessed a process in which the solder pot operator used Techspray WSOL water soluble masking to cover the areas around a connector that was to be soldered on the solder pot. He did not wait for the WSOL to cure. He soldered immediately.

WSOL and solder pot

Electronics Forum | Wed Mar 12 16:20:51 EDT 2008 | hussman

Poor training. Don't blame the operator, he was either shown this or left to his own devices. Be the better man and provide him a better process. Regular old peelabale solder mask would be a start.

WSOL and solder pot

Electronics Forum | Fri Mar 14 11:18:29 EDT 2008 | operator

The way it works is the liquid solder immediatley cures (or should I say burns) the WSOL where ever it touches it. This hardens and keeps it in place and protects whatever is under it. Some of the WSOL falls of in the pot. I am suprised that the burn

Altitude and solder voids

Electronics Forum | Thu Nov 01 10:57:34 EDT 2012 | kris1128

Has anyone heard whether the elevation of a plant can effect solder joint formation? One plant at sea level, one at 7,000 feet elevation... same equipment and profiles, big voiding defects at higher elevation. I did a search and found no similar post

solder balls and flux

Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann

My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink

solder balls and flux

Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann

My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink

WSOL and solder pot

Electronics Forum | Wed Mar 12 16:30:45 EDT 2008 | operator

I witnessed this at our sister company. It seems to be their standard process. It is not my place to interfere with their processes. I was just curious if there was any chance of brittle solder joints or other defects that might be caused from the WS

WSOL and solder pot

Electronics Forum | Thu Mar 13 09:43:13 EDT 2008 | jseagle

If the mask is not cured and is coming off in the pot I don't see how it is protecting anything. If you want to mask something fast you need to use tape not liquid mask that requires cure. My $.02.

No solder and solder bridge after Wave solder machine

Electronics Forum | Thu Nov 17 03:34:51 EST 2005 | cangly

Hi, We have a board with over 100 chips (mixed size) and some long Connector DIP through out Wave solder with many issues of no solder and solder bridge, (using clean flux with bubble fluxer and Kester solder bar). Currently we tried to reduce the de

  1 2 3 4 5 6 7 8 9 10 Next

spill and solder searches for Companies, Equipment, Machines, Suppliers & Information