Industry News: stacked (Page 1 of 31)

Heller Industries Commended by Frost & Sullivan for Delivering Unmatched Customer Value through Its Reflow Soldering Technology

Industry News | 2019-12-09 14:44:26.0

The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.

Heller Industries Inc.

DPAC Technologies Strengthens Board of Directors with New Independent Board Member

Industry News | 2003-04-28 07:47:37.0

DPAC exceeds requirements of Sarbanes-Oxley Act in independence and financial expertise for the DPAC Technologies Board

SMTnet

Legacy Electronics Receives U.S. Patent for 3-D Memory Module with Canopy-type Carriers

Industry News | 2003-05-30 08:26:20.0

The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.

SMTnet

Connectors Save Space in Basestation Power Supply

Industry News | 2003-04-29 08:27:33.0

Emerson Energy Systems is using Weidmuller's Minimate S2L/B2L PCB connector for its IMT 2000 multifunction unit, thanks to its space saving design and competitive price.

SMTnet

Desktop Systems Provide Flexible Bonding

Industry News | 2003-06-10 08:39:25.0

New from Unitek Eapro is a series of desktop systems for hot bar bonding applications.

SMTnet

MIRTEC to Preview the MP-520 Advanced System in Package (SiP) Inspection and Measurement System at SEMICON West 2015

Industry News | 2015-06-11 16:02:18.0

MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.

MIRTEC Corp

MIRTEC's MV-6Z OMNI 3D AOI with Z-Axis Multi-Focus Vision Imaging System at SMTAI

Industry News | 2022-10-04 11:37:37.0

MIRTEC is pleased to announce plans to exhibit at SMTA International, scheduled to take place Nov 2-3, 2022 at the Minneapolis Convention Center in Minnesota. The MIRTEC team is looking forward to meeting with attendees at booth #906 for a detailed demonstration of its MV-6Z OMNI 3D In-Line AOI system.

MIRTEC Corp

Virtex-II FPGA Prototyping Boards Enable Complex FPGA Design Evaluation & Testing

Industry News | 2003-06-16 09:12:35.0

Boards tout up to 8MGates devices, on-board RAM, banks of I/O, many programmable user interfaces

SMTnet

MIRTEC to Exhibit Its Award-Winning MV-6Z OMNI 3D AOI System at SMTAI 2021 Minneapolis, MN

Industry News | 2021-10-04 13:48:55.0

MIRTEC is pleased to announce their plans to exhibit at the SMTA International Exposition, scheduled to take place Nov. 3-4, 2021, at the Minneapolis Convention Center in Minneapolis, MN. The MIRTEC team is looking forward to meeting with attendees at booth #3500 for a detailed demonstration of its MV-6Z OMNI 3D In-Line AOI system.

MIRTEC Corp

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