Electronics Forum | Thu Mar 28 13:19:14 EDT 2019 | davef
There is no industry standard for BTC stand-off height. "IPC-7093A Design and Assembly Process Implementation for Bottom Termination SMT (BTC) Components" just finished "Final Draft for Industry Review" in December 2018. It mentions stand-off height
Electronics Forum | Wed May 06 23:46:31 EDT 1998 | Thomas Nisbet
We want to insert LED's on .100 center's with a UIC Rad 2. The LED must have plastic standoff on the leads before they are inserted. Are there any tape & reel machines that will put the standoff on the LED and then put the component on tape & Reel. A
Electronics Forum | Mon Jun 01 12:31:35 EDT 1998 | Don Spicer
| We want to insert LED's on .100 center's | with a UIC Rad 2. The LED must have plastic | standoff on the leads before they are inserted. | Are there any tape & reel machines that will | put the standoff on the LED and then put the component | on ta
Electronics Forum | Thu Aug 17 17:51:47 EDT 2006 | davef
We use plastic standoffs that fit between the LED and the board. Live well, live long. For more than you wanted to know about standoffs: http://www.reedlink.com/ProductInfo~Productid~158255~ProductName~LED-Standoffs.html
Electronics Forum | Tue Oct 19 17:52:47 EDT 1999 | John Thorup
Hi Carol You can use a threaded standoff and put a screw through the board and into the standoff with the screw from the buss bar coming into the other end of the standoff. You should use a SEMS type screw or a internal star type lockwasher with a pl
Electronics Forum | Wed Nov 12 04:34:17 EST 2008 | kywl
Hi all, Assuming that i were to design a PCB and there are multiple components, what is the minimum spacing required to ensure that i won't have problems in my SMT process later on? Also, is there a minimum component stand-off height spec as well?
Electronics Forum | Thu Nov 13 22:20:48 EST 2008 | davef
For your pad layout and spacing between components, look here: http://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=77b562c1-b8f8-db11-8a6a-005056875b22 For your standoff height in SMT, we do not concern ourselves with standoff height. It
Electronics Forum | Wed Mar 24 15:15:35 EST 2004 | davef
I think you can effectively clean under any other low standoff device. It's an issue of surface tension, pressure, and flow rate. DI water is the starting point, but the surface tension of straight DI water makes it difficult to get under low stand
Electronics Forum | Tue Oct 03 11:35:51 EDT 2000 | aaronho
Screen printing has much lower profile than dispensing. So it is suitable for chips without body stand-off, (Even sot23 has stand-off). But is is much faster. Dispensers can not catch up with some chip shooters.
Electronics Forum | Wed Dec 08 08:38:46 EST 2004 | davef
KS: You're correct. The standoff on a 1.00mm and 1.25mm BGA is high enough to allow cleaning. The standoff on 0.8mm BGA does not allow proper cleaning, even with saponifiers.
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