Industry Directory | Manufacturer
Fine Line Stencil is committed to delivering the highest quality stencil technology in the industry.
Industry Directory | Manufacturer
Shenzhen Huancheng Automation equipment Co.,ltd (referred to as the "HC"), a High-speed developing enterprise specializing in High Precision Automatic Solder Paste Printer research and development.
Yamaha S20 Modular Pick and Place Machine ❙ Features of Yamaha SMT S20 Pick and Place Machine Yamaha 3D hybrid modular pick and place machine, Yamaha SMT chip mounter, Yamaha S20 placement speed 45,000CPH, applicable components 0201 (mm)
JUKI RX-6R SMD Pick and Place Machine ❙ Introduce of JUKI RX-6R High Speed Compact Modular pick and place machine, JUKI RX-6R SMT placement, JUKI PCB Chip Shooter, Speed and Flexibility for High Quality Production of any PC
Electronics Forum | Fri Mar 04 14:23:47 EST 2011 | mosborne1
Does anyone have any recomendations on 01005 stencil aperatures? Stencil thickness?
Electronics Forum | Mon Apr 09 20:55:46 EDT 2012 | action_101
I forgot to add that we are using a 3 mil stencil. It seems like to me that may be there isn't enough flux left when we reach liquidous?? About half of the solder spheres do melt and wet on each pad, but the top half of each solder joint is just the
Used SMT Equipment | Screen Printers
2014, Manncorp PB2300 semi-auto solder paste screen printer, with vision, good working condition. Also available with a 2014 Manncorp reflow oven and a 2008 MC387-V2 with feeders FOB: Origin / Ex-works Contact: AssuredTechnicalServiceLLC@Gmail.
Industry News | 2011-03-28 13:24:06.0
Eleven products have been selected for inclusion in the Innovative Technology Center at IPC APEX EXPO™, April 12–14, 2011, in Las Vegas, according to show organizer IPC – Association Connecting Electronics Industries. Assessed by a review board of industry experts, the products were selected based on their representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry.
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Technical Library | 2021-11-17 18:53:50.0
The demand for product miniaturization, especially in the handheld device area, continues to challenge the board assembly industry. The desire to incorporate more functionality while making the product smaller continues to push board design to its limit. It is not uncommon to find boards with castle-like components right next to miniature components. This type of board poses a special challenge to the board assemblers as it requires a wide range of paste volume to satisfy both small and large components. One way to address the printing challenge is to use creative stencil design to meet the solder paste requirement for both large and small components. ... The most important attribute of a stencil is its release characteristic. In other words, how well the paste releases from the aperture. The paste release, in turn, depends on the surface characteristics of the aperture wall and stencil foil. The recent introduction of new technology, nano-coating for both stencil and squeegee blades, has drawn the attention of many researchers. As the name implies, nano-coated stencils and blades are made by a conventional method such as laser-cut or electroformed then coated with nano-functional material to alter the surface characteristics. This study will evaluate nano-coated stencils for passive component printing, including 01005.
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
Yamaha S20 Modular Pick and Place Machine ❙ Features of Yamaha SMT S20 Pick and Place Machine Yamaha 3D hybrid modular pick and place machine, Yamaha SMT chip mounter, Yamaha S20 placement speed 45,000CPH, applicable components 0201 (mm)
SMT Nozzle Cleaning Machine ETA-24/36 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCBA Cleaning Machine, On-line PCBA Cleaning Machine,
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Fremont, California USA | Engineering,Production
4 years of PCB assembly process.
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SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS
0201 and 01005 Adoption in Industry 0201 and 01005 Adoption in Industry First introduced in the year 2000, the 0201 package was sold in significant numbers in the electronics industry by 2003. According to some estimates, it currently accounts
01005 Assembly, the AOI route to optimizing yield News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! 01005 Assembly, the AOI route to optimizing yield. The increasing demand
| https://www.smtfactory.com/SMT-Automatic-Intelligence-Splicing-Machine-pd40418362.html
I.C.T Team News & Events Global Partners SMT Equipment SMT Production Line Full-auto SMT Line Semi-auto SMT Line Reflow Oven Pyxis Series Lyra Series L Series T Series S Series SMT Stencil Printing Machine Semi-auto
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic1384&OB=DESC.html
0.10 mm for the 01005 package. Then the 0201 was set in the middle at 0.12 mm Toe. Thinning the paste mask stencil is also required but that information will reside in the new IPC-7070
