Electronics Forum | Wed Apr 13 09:43:00 EDT 2011 | dyoungquist
A bit more information will help people give a more educated response. What size res/caps? Any fine pitch ICs? BGAs? Lead or lead free? What quantity of components and/or boards are you loading? Will it be high mix, low volume or lower mix, hig
Electronics Forum | Wed Aug 18 17:59:09 EDT 1999 | Mik Horvath
| | Hi, | | I'd like to ask some tips about the merits and shortcomings o | | of both screen printer and stencil printer. For small quantity and highly mixed usage, which type of printer is suitable to our | | application? | | The boards contain
Electronics Forum | Wed Aug 18 18:10:33 EDT 1999 | Mik Horvath
| | Hi, | | I'd like to ask some tips about the merits and shortcomings o | | of both screen printer and stencil printer. For small quantity and highly mixed usage, which type of printer is suitable to our | | application? | | The boards contain
Electronics Forum | Wed Aug 18 15:20:25 EDT 1999 | John Thorup
| Hi, | I'd like to ask some tips about the merits and shortcomings o | of both screen printer and stencil printer. For small quantity and highly mixed usage, which type of printer is suitable to our | application? | The boards contain no BGA and
Electronics Forum | Wed Aug 18 21:10:23 EDT 1999 | se
| | | Hi, | | | I'd like to ask some tips about the merits and shortcomings o | | | of both screen printer and stencil printer. For small quantity and highly mixed usage, which type of printer is suitable to our | | | application? | | | The board
Electronics Forum | Thu Aug 30 13:06:10 EDT 2018 | emeto
I don't know your board, but for this specific part: 10mil round aperture on a 3.5mil stencil with type 4 paste wold be ideal
Electronics Forum | Fri Aug 24 13:21:59 EDT 2018 | babe7362000
What do others use as far as solder paste type, stencil thickness and aperature size for a .4mm Ball Pitch CSP. Ball diameter is .3mm. Please let me know your thoughts or what you use. Thanks
Electronics Forum | Wed Aug 29 03:16:20 EDT 2018 | cannizzaro
It is recommended that the thickness of the stencil of 0.1mm, the steel mesh should be partially nano-coated. It is best not to dry easily, and the particles are not easy to be too large. I have tried ALLPCB for this kind of BGA in the past and they
Electronics Forum | Thu Sep 05 23:18:03 EDT 2013 | feiyangniao
There is a new toy I received today: a NeoDen TM-240A automatic desktop pick and place machine! I’ve kept my eyes on this baby for a quite a while, and finally decided to make a purchase last week. The shipping was very fast: DHL from China, a total
Electronics Forum | Mon Sep 17 16:03:13 EDT 2001 | jschake
The results from an experiment comparing 27 different combinations of pad dimensions concluded that the pad design with 15 mil pad length, 12 mil pad width, and 9 mil pad separation produced the best assembly yields. A 5 mil thick laser cut stencil
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