Electronics Forum | Mon Oct 14 14:35:51 EDT 2013 | garym4569
Thanks for the replies. I have just ordered the IPC Stencil Design Guidelines manual.
Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr
My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone
Electronics Forum | Wed Sep 18 12:35:56 EDT 2002 | stepheno
Fourth - > back to design of PCB. Are there solder dams of > mask between the pads? If yes, that helps. If > not, pay close attention to stencil aperture > width and be sure that the aperture deposits less > paste by 1-2 mils per pad, centered o
Electronics Forum | Wed Sep 18 18:41:17 EDT 2002 | davef
People have made good comments. Additional points are: * Your bridging is probably being caused by one or more of the following: [1] printing too much paste, [2] smearing the paste during placement or subsequent handling, or [3] paste slump during t
Electronics Forum | Thu Oct 17 21:13:35 EDT 2013 | hegemon
But where does it go, that it needs to be refreshed or replenished on the stencil? Does that "just like wax" product wind up in my solder joints, no matter how small the percentage, and would it then qualify as a contaminant? I heard there are some (
Electronics Forum | Fri Oct 18 08:54:18 EDT 2013 | emeto
Hege, the Nano coating goes on the opposite of the squeegee side of the stencil. I don't know if the cleaning paper is able to remove it little by little with the time, but I never refreshed my stencils with Nano coating and they work just fine. How
Electronics Forum | Mon Oct 14 10:53:28 EDT 2013 | emeto
0.5 if you use electroformed stencil or > 0.8 if you use laser cut. 2. Always use fresh paste 3. Uses the right printer parameters for your paste(for example Alpha likes fast release of the stencil from the board - in DEK this is called separation s
Electronics Forum | Fri Oct 18 09:27:53 EDT 2013 | dontfeedphils
I believe it's mostly worn off through cleaning solvents and the slight abrasion during the under stencil cleaning process. I couldn't say whether or not it's ever in a state that would allow it to transfer to the PCB though.
Electronics Forum | Mon Oct 14 14:11:39 EDT 2013 | island2013
Yes, I agree with Evtimov. It's more about aperature reduction and type than it is the type of machine. Aspect and and Area Ratio are very important. Take a look at this page I found on the internet http://www.qualiecocircuits.co.nz/stencil-techno
Electronics Forum | Sat Oct 12 13:49:08 EDT 2013 | garym4569
Has anyone had success using a DEK Proflow printhead with fine pitch components (~.2mm pitch). I have been told that squeegees are the way to go for fine pitch. What other major factors play a role in successfully printing fine pitch. Print speed,
