DIP Double-side Camera Online AOI Machine ETA-V5300 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI mac
SMT 3D High-Quality Off-line AOI Machine - Advanced Automated Inspection Solution ❙ Introduction of Off-line SMT AOI I.C.T high quality SMT AOI, Off-line SMT AOI Machine, PCBA automatic optical inspection equipment, efficient and fast, accurate d
Electronics Forum | Sat Dec 04 09:23:20 EST 1999 | Christopher Lampron
Kantesh, Does this particular part have a heat sink across the bottom side of the component and does your pad size and stencil aperture match the component? I have just had a very similar problem with a DPAK. What we found was that the recomended pad
Electronics Forum | Sat Dec 04 09:42:18 EST 1999 | Chris McDonald
Just as explained in a follow-up you are getting too much paste on the pad. The pad is probably the right size but you cant have your aperature the same size as your pad. What we have done is put a Cross in the stencil. This will reduce the paste and
Industry News | 2008-09-16 13:46:12.0
DEK has unveiled its brand new 2D Inspection (2Di) V9 software tool, adding even more functionality to the next-generation Instinctiv� V9 advanced machine user interface. Delivering enhanced control of the mass imaging specialist's proven inspection system, 2Di V9 closely monitors the print process to raise productivity and reduce manufacturing costs.
Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Technical Library | 2023-06-12 19:46:10.0
Solder paste printing is understood to be the leading contributor of defects in the electronics assembly process. Because yield accounts for such a large percentage of the margin, the greatest opportunity to improve profitability in the assembly of most electronics can be gained by reducing or eliminating solder defects. This article examines process adjustments made through stencil design that correct a misalignment situation between the PCB and stencil, leading to a 43% reduction in assembly defects. Examples of each are found in Table 1.
Technical Library | 2013-03-12 13:25:18.0
High density and miniaturized circuit assemblies challenge the solder paste printing process. The use of small components such as 0201, 01005 and μBGA devices require good paste release to prevent solder paste bridging and misalignment. When placing these miniaturized components, taller paste deposits are often required. To improve solder paste deposition, a nano-coating is applied to laser cut stencils to improve transfer efficiency. One concern is the compatibility of the nano-coating with cleaning agents used in understencil wipe and stencil cleaning. The purpose of this research is to test the chemical compatibility of common cleaning agents used in understencil wipe and stencil cleaning processes.Compatibility of Cleaning Agents With Nano-Coated Stencils
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Integrated Offset Placement in Electronics Assembly Equipment The Answer for Solder Paste Misalignment News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Integrated Offset
Integrated Offset Placement in Electronics Assembly Equipment The Answer for Solder Paste Misalignment News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Integrated Offset
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. The actual process is summarised below: Firstly, a PCB stencil is aligned on the surface of the boards and solder paste is applied using a squeegee to ensure the pads are coated with a uniform and controlled amount of solder paste
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