Industry News | 2019-11-05 22:16:43.0
Flex PCBs are thin, light weight and easy bending, this gives much difficulty in the process of component assembly. Stiffeners are used to reinforce those areas where components will be assembled. There are many different material can be used as stiffeners, like polyimide, kapton, FR-4, Aluminium, etc, designer need to select the right material based on their thickness and characteristics.
Industry News | 2010-05-05 23:20:11.0
Niedernhall – PCB specialist Würth Elektronik once again demonstrates its competence in system solutions and customer support; now offering one-stop flex-rigid PCB solutions with ZIF contacts and custom designed ZIF connectors.
Industry News | 2009-10-16 17:03:59.0
The 2009 edition of China's Electronics Industry analyses the current status and development of China's key high tech industry in the context of the unique political, economic and science and technology forces in China today.
Industry News | 2011-01-05 16:07:01.0
Virtual Industries Inc. announces that it will display several advanced systems in Booth 2141 at the upcoming SPIE Photonics West exhibition, scheduled to take place January 22-27, 2011 at the Moscone Center in San Francisco.
Industry News | 2012-01-20 15:26:12.0
Virtual Industries will display several advanced systems in Booth #628 at the upcoming IPC APEX Expo.
Industry News | 2013-01-17 13:59:01.0
Virtual Industries Incannounces that it will display several advanced systems for part handling in Booth #2726 at the upcoming IPC APEX EXPO
Industry News | 2013-10-24 13:54:32.0
Virtual Industries Inc. announces that it will display three new and advanced systems for part handling in Stand #B2.259 at the 20th international Productronica International Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
Industry News | 2010-07-09 13:02:47.0
Vi TECHNOLOGY introduces the REVEAL Imager Series, at SEMICON West 2010 from July 13th to 15th, Booth 5377 - North Hall – San Francisco Moscone Center. Along with the product an automatic JEDEC Tray loader compatible with both REVEAL Imager and REVEAL MEMS Series will be demonstrated.
Industry News | 2010-08-17 14:38:04.0
Vi TECHNOLOGY exhibits its latest semiconductor AOI solution REVEAL Imager at Semicon Taiwan 2010 (Taipei World Trade Center) from September 8th to 10th, in co-exhibition with STC at booth 862.