Industry News: stop and baking and boards (Page 1 of 9)

YXLON International and MIRTEC Announce Close Cooperation Empowering Industry 4.0 in the Electronics Production Market

Industry News | 2015-05-07 19:28:29.0

MIRTEC announce a new strategic cooperation that will empower yield improvement in the electronics manufacturing industry.

MIRTEC Corp

IPC Delivers New Standard on Handling, Packaging and Storage of Printed Boards

Industry News | 2010-09-13 15:36:15.0

IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.

Association Connecting Electronics Industries (IPC)

SMT, Inc. and Eruston Corp. Partner to Offer Complete Turnkey Manufacturing

Industry News | 2014-01-03 18:29:15.0

Surface Mount Technologies, Inc. announces that it has teamed with Eruston Corporation to offer complete turnkey manufacturing.

Surface Mount Technology Association (SMTA)

IPC APEX EXPO Raising Funds for Academic Scholarships and Japanese Red Cross

Industry News | 2011-04-07 18:29:45.0

After its successful launch in 2010, the IPC Foundation Silent Auction will return to IPC APEX EXPO™, April 12–14, 2011, in Las Vegas. Proceeds of the Silent Auction directly fund IPC Foundation initiatives, such as the All-Academic Poster Competition and technical conference scholarships.

Association Connecting Electronics Industries (IPC)

Count On Tools to Introduce New SMT Nozzles and Consumables at APEX 2011

Industry News | 2011-03-11 14:17:49.0

Count On Tools Inc. will introduce its latest developments in SMT nozzles and consumables in Booth #1965 at the upcoming at the upcoming IPC APEX conference and exhibition, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.

Count On Tools, Inc.

Poll Finds Solder Finish, BGA Components and Reflow Soldering Most Challenging for Industry Engineers

Industry News | 2012-01-22 23:16:58.0

More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.

Association Connecting Electronics Industries (IPC)

New Products at IPC APEX EXPO 2016 to Showcase Forward-Thinking Technology and Innovation

Industry News | 2016-02-15 20:06:55.0

New opportunities and answers to industry challenges will abound as leaders in the electronics manufacturing industry debut cutting-edge products and services at IPC APEX EXPO®, March, 15–17, 2016, at the Las Vegas Convention Center. In keeping with the event’s theme, “Forward Thinking for Tomorrow’s Technology,” a significant number of exhibitors will be introducing new products at the show. Exhibitors will also feature chemicals, materials, and equipment for PCB manufacturing, as well as design software and printed electronics.

Association Connecting Electronics Industries (IPC)

Resin plug application and process

Industry News | 2019-05-16 01:24:13.0

With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development trend. The application of the resin plugging process has also become more and more extensive, and it has been used in HDI panels.

Headpcb

MacDermid Alpha to Exhibit and Present at TPCA and IMPACT

Industry News | 2021-12-13 12:52:59.0

MacDermid Alpha Electronics Solutions will be exhibiting at the Taiwan Printed Circuit Association (TPCA) exhibition and will present at the IMPACT Conference, co-located with TPCA at the Nangang Exhibition Center Taipei, Taiwan, December 21-23, 2021.

MacDermid Alpha Electronics Solutions

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