Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Manufacturer
Sanlo specializes in the design and manufacture of custom mechanical cable assemblies, well as services including prototyping, tensile strength testing, and material and process certifications.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Electronics Forum | Wed Nov 26 09:16:59 EST 2008 | barryg
Hello everyone, after a short layoff I am glad to be back. I have a question. I have a button (snap button) that is being soldered to a strip of sac coated copper. We are questioning the joint strength of this from our vendor as we see these popping
Electronics Forum | Fri Sep 02 08:46:06 EDT 2005 | davef
Just to be clear, Pete C is referring to the August 2005 SMT Magazine.
Used SMT Equipment | In-Circuit Testers
Rohde & Schwarz FSH6 Series Spectrum Analyzers Rohde & Schwarz, Inc. FSH6 Series Handheld spectrum analyzer 100 kHz - 6 GHz, RBW 100 Hz -1 MHz, LCD color display, preamplifier FSH606: Bandwidth 100 Hz to 1 MHz FSH626: Bandwidth 100 Hz to 1 M
Used SMT Equipment | In-Circuit Testers
Fujikura FSM-40PM To keep up with the development of DWDM optical communication devices, we developed the FSM40PM for splicing of PM fibers. The FSM-40PM splices dissimilar fiber combinations, especially Erbium-doped fiber to single-mode fiber us
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Industry News | 2023-10-18 17:43:18.0
HELLER's High UPH Vacuum Reflow Oven clinched the coveted "Step-by-Step Excellence Awards" - Innovation Award owing to its industry-leading product strength and outstanding performance.
Parts & Supplies | Screen Printers
Name: imported stainless steel mixing knife (metal / wood handle) Part Number: Universal Description: Imports of stainless steel mixing knife (metal / wood handle); stainless steel mixing knife Applicable models: all presses Imports of stai
Parts & Supplies | SMT Equipment
Imported stainless steel mixing knife Name: imported stainless steel mixing knife (metal / wood handle) Description: Imports of stainless steel mixing knife (metal / wood handle); stainless steel mixing knife Applicable models: all presse
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2019-05-23 10:42:00.0
Why identify flux residues? The primary purpose of flux is to reduce species of metal oxides from solderable surfaces, and to act as a mechanism for lifting and removing debris. If the assembly is not properly cleaned after manufacturing, flux may continue to reduce metals and may eventually corrode the assembly. When the assembly is powered, the metal ions may precipitate along electromagnetic field lines and form dendritic shorts. In addition, the presence of residue can alter the insulation properties of a board, affect the adhesion of the conformal coating, or interfere with the moving parts of the assembly. In radio frequency (RF) applications, flux may change the RF properties on the surface of the printed circuit board (PCB) such as the dielectric strength, surface resistance, and Q-resonance.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Events Calendar | Tue Apr 06 00:00:00 EDT 2021 - Tue Apr 06 00:00:00 EDT 2021 | ,
Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement
Events Calendar | Wed Dec 04 00:00:00 EST 2019 - Fri Dec 06 00:00:00 EST 2019 | Shenzhen, China
2019 International Electronics Circuit Exhibition
Career Center | , Alabama Malaysia | Management,Production,Sales/Marketing
Global CEM Has opportunity for US based sales executive to work on an Ex-Pat package in Asia for minimum of 2 year committment. This opportunity allows you to gain international sales experience, take advantage of tax free income while traveling the
Career Center | , Washington USA | Engineering,Management,Sales/Marketing
Do yor sales abilities over sell your current EMS employer? Are you tired of bringing in millions of dollars of potential new business, only to find out your company cannot close the deals or doesn't have the capacity to handle your clients? If you
Career Center | hamtramck, Michigan USA | Production
• (from)2004 (to)2008 o Alterra Clare Bridge – Customer service, Dining Service Manager,Office Administrator #248-489-9362 . (from)2010 (to)2011 Yossi’s – Kitchen Manager, Pre Cook
Career Center | vapi,gujrat, India | Engineering
analog and digital electronics circuit,VLSI,microprocessor and microcontroller,semiconductor,wireless communication.
SMTnet Express July 11, 2013, Subscribers: 26149, Members: Companies: 13418, Users: 34911 Effect of BGA Reballing and its Influence on Ball Shear Strength by S. Manian Ramkumar Ph.D., Andrew J. Daya, Daniel B. Lewanda; Rochester Institute
| https://www.eptac.com/ask/copper-elongation-and-tensile-strength-requirements/
Copper Elongation and Tensile Strength Requirements - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.smtfactory.com/I-C-T-is-always-Keeping-Improving-the-Comprehensive-Strength-id46753977.html
I.C.T is always Keeping Improving the Comprehensive Strength - I.C.T SMT Machine English Bahasa indonesia Сербия Česky Dansk Deutsch Español
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