Industry Directory | Manufacturer
Designers and manufacturers of Printed Circuit Boards and Flex Strip
Hi-Q Materials provides prototypw, quickturn substrates with fine line geometry. Also sell equipment for substrate fab using photoimagable technology. R&D in advanced packaging materials.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Full-featured and compact benchtop dispense system robot offering accurate and repeatable dispense results! A benchtop dispense system does not mean "no features". The Catalina benchtop dispense system is a full-featured platform with these standard
Electronics Forum | Tue Jan 29 09:19:56 EST 2002 | bob_smith
Can someone tell me what metal substrates are comonly used for component leads with gold plating? If the gold plating is missing, are any of the substates incompatible with 63/37 solder? Thanks.
Electronics Forum | Tue Oct 29 11:20:17 EST 2002 | nifhail
Guys, Has anyone considered the specific use of Halogen free substrates for enhanced PCB performance? What is the impact on the PCB price ? Pls help.thank you in advance.
Used SMT Equipment | SMT Equipment
JUKI KE2050 SMT 13,200CPH: Chip (laser identification / actual production efficiency), laser stickers titles x 1 (4 nozzle), 0603 (Imperial 0201) chip to 20mm square element, or 26.5 * 11mm. 0402 (Imperial 01005) chip factory option specifications:
Used SMT Equipment | Pick and Place/Feeders
Product number: FX-3 Detailed product introduction FX-3 JUKI parameters The best conditions: 0.040 seconds / chip(90000CPH) * The laser head*4 (24 nozzle) 0402 chip ~33.5mm square elements (ordiagonal Long 47m) Feeder number: up to 120 (using
Industry News | 2016-06-27 14:59:09.0
GPD Global introduces the NEW TempView Thermal Imaging System that ensures the success of heated dispensing processes like Underfill, Encapsulations, Dam and Fill, and more. The TempView Thermal Imaging System monitors the temperature of the entire substrate for complete heat profile characterization. Regions of the product may be selected for monitoring during the heating process. Now you can accurately monitor temperature of specific devices to be sure they are up to temperature before starting a process.
Industry News | 2016-11-07 16:28:47.0
GPD Global expands the performance of its automated dispense systems to run fundamental Pick & Place operations.
Parts & Supplies | Semiconductor & Solar
JUKI KE - 2080 parameters Substrate size M-type substrate (330×250mm) L-shaped substrate (410×360mm) L-wide substrate (510 x 360mm) (optional) E-type substrate (510×460mm) Mount component height 12mm / 20mm / 25
Parts & Supplies | Semiconductor & Solar
Product number: YG200 Products in detail Yamaha YG200 high-speed SMT machine Speed: 0.08 seconds/CHIP (IPC9850conditions) 1608 CHIP: 34800 CPH (0.103 seconds/CHIPconversion) 16 pinsop: 24400 CPH (0.147 SEC/SOPconversion) (Max 80 varieties
Technical Library | 2020-01-28 00:23:58.0
This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.
Technical Library | 2024-03-19 15:53:34.0
Underfill is a composite material usually made of an epoxy polymer that fills gaps between a chip and its carrier or a finished package and the PCB substrate to connect the chip to the board.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Mon Sep 14 00:00:00 EDT 2020 - Mon Sep 14 00:00:00 EDT 2020 | ,
Printed Circuit Board (PCB) Inspection & Quality Control
Career Center | Dallas, Texas USA | Engineering
Job description: Engineer is responsible for the design of RF, Microwave and support circuitry for miniaturized Rf/Wireless modules utilizing highlt integrated semiconductors and an array of substrate and packaging technologies. Will design, simula
Career Center | , | Engineering
Job description This position is for a Mechanical Engineer involved in supporting, developing, and improving microelectronics manufacturing processes to optimize Quality, On-Time Delivery, and Cost with an emphasis on Safety. Implementation of Lean M
Career Center | GARLAND, Texas USA | Production
exp in Fuji, Juki and universal smt pick and place machines . Component verification.
Career Center | GARLAND, Texas USA | Production
Fuji, Juki, Universal SMT pick and place machines experience.
| https://www.smtxtra.com/shop/smt-spare-parts-consumables/spares-fuji/fuji-fuse1a-h2001e/
Fuji Substrate Fuse 1.0A (H2001E) - SMT Xtra About Us Contact SMT XTRA +44 (0) 1302 247295 HOME SMT NOZZLES ASM (Siemens) Siplace Assembleon / Philips FUJI HITACHI IPULSE JUKI MIRAE PANASONIC SAMSUNG SANYO SONY UNIVERSAL YAMAHA SMT FEEDERS ASM (Siemens
Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-substrate/
Which PCB Substrate Should I Use? | Imagineering, Inc. Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances Certifications
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