Industry Directory | Distributor
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Industry Directory | Consultant / Service Provider
Elmet LLC is an accredited lab, primarily providing cross sectioning of circuit boards, visual and x-ray inspections of PCBAs and other metallographic and metallurgical services including SEM examination and EDS analysis.
New Equipment | Board Handling - Storage
Stentech's Vacuum Plates provide support for the circuit board during the assembly process. Because we now manufacture highly complex and dense boards, this has become critical to avoid warping, sagging, and bending of the board. Vacuum plates wil
New Equipment | Industrial Automation
Skype^ : dddemi33 Sales&Manager : Tiffany Guan RFQ#e-mail : plcsale@mooreplc.com Whats@app : +86 18030235313 Relatied In Stock Items : (Competitive Price) TRICONEX 3604E TRICONEX 3664 TRICONEX 3700A TRICONEX 3721 TRICONEX 4119A TRICONEX
Electronics Forum | Tue Oct 11 12:56:27 EDT 2005 | stepheniii
And consider the posibility that they are actually suffering from MSD type damage.
Electronics Forum | Tue Jul 13 11:32:03 EDT 1999 | Chrys Shea
I tried to download Ed Smith's paper titled "Lead Free - a push in the wrong direction?" today, but it wasn't there for downloading. Could this be suffering from the same issues I had with my last paper, in that the file size was too large and it ne
Used SMT Equipment | General Purpose Equipment
Year 2008 - Like New Condition Tyco SEP 3T Shuttle Electric Press Standalone electric press for the application of PCBs onto compliant pin housings or connectors • Servo electric press with shuttle system for product location under press ram • Ho
Used SMT Equipment | In-Circuit Testers
Stanford Research DS360 Function Generators The performance of a low distortion analog source and the precision of direct digital synthesis (DDS) is combined in the DS360. With less than 0.001 % total harmonic distortion (THD), 25 ppm frequency a
Industry News | 2020-11-03 18:16:39.0
2020 Global Surface Mount Technology Company Of The Year Award (Soldering Equipment)
Industry News | 2003-02-24 09:54:40.0
Effective March 3, Cookson Electronics Assembly Materials (Jersey City, NJ) will increase prices for its products by an average of 3 percent, the company announced today.
Parts & Supplies | X-Ray Inspection
Dera Friends, our FEINFOCUS COUGAR - VXP suffered a hd crash and we do not have the system software to reinstall. WHO CAN PLEASE HELP US??? Thank you Jasper jvanmeerten@kvms.be
Technical Library | 2021-11-03 17:05:39.0
Additively printed circuits provide advantages in reduced waste, rapid prototyping, and versatile flexible substrate choices relative to conventional circuit printing. Copper (Cu) based inks along with intense pulsed light (IPL) sintering can be used in additive circuit printing. However, IPL sintered Cu typically suffer from poor solderability due to high roughness and porosity. To address this, hybrid Cu ink which consists of Cu precursor/nanoparticle was formulated to seed Cu species and fill voids in the sintered structure. Nickel (Ni) electroplating was utilized to further improve surface solderability. Simulations were performed at various electroplating conditions and Cu cathode surface roughness using the multi-physics finite element method. By utilizing a mask during IPL sintering, conductivity was induced in exposed regions; this was utilized to achieve selective Ni-electroplating. Surface morphology and cross section analysis of the electrodes were observed through scanning electron microscopy and a 3D optical profilometer. Energy dispersive X-ray spectroscopy analysis was conducted to investigate changes in surface compositions. ASTM D3359 adhesion testing was performed to examine the adhesion between the electrode and substrate. Solder-electrode shear tests were investigated with a tensile tester to observe the shear strength between solder and electrodes. By utilizing Cu precursors and novel multifaceted approach of IPL sintering, a robust and solderable Ni electroplated conductive Cu printed electrode was achieved.
Technical Library | 2020-09-02 22:02:13.0
With the adoption of Wafer Level Packages (WLP) in the latest generation mobile handsets, the Printed Circuit Board (PCB) industry has also seen the initial steps of High Density Interconnect (HDI) products migrating away from the current subtractive processes towards a more technically adept technique, based on an advanced modified Semi Additive Process (amSAP). This pattern plate process enables line and space features in the region of 20um to be produced, in combination with fully filled, laser formed microvias. However, in order to achieve these process demands, a step change in the performance of the chemical processes used for metallization of the microvia is essential. In the electroless Copper process, the critical activator step often risks cross contamination by the preceding chemistries. Such events can lead to uncontrolled buildup of Palladium rich residues on the panel surface, which can subsequently inhibit etching and lead to short circuits between the final traces. In addition, with more demands being placed on the microvia, the need for a high uniformity Copper layer has become paramount, unfortunately, as microvia shape is often far from ideal, the deposition or "throw" characteristics of the Copper bath itself are also of critical importance. This "high throwing power" is influential elsewhere in the amSAP technique, as it leads to a thinner surface Copper layer, which aids the etching process and enables the ultra-fine features being demanded by today's high end PCB applications. This paper discusses the performance of an electroless Copper plating process that has been developed to satisfy the needs of challenging amSAP applications. Through the use of a radical predip chemistry, the formation, build up and deposition of uncontrolled Pd residues arising from activator contamination has been virtually eradicated. With the adoption of a high throwing power Copper bath, sub 30um features are enabled and microvia coverage is shown to be greatly improved, even in complex via shapes which would otherwise suffer from uneven coverage and risk premature failure in service. Through a mixture of development and production data, this paper aims to highlight the benefits and robust performance of the new electroless Copper process for amSAP applications
The little big one from Ersa in selective soldering - SMARTFLOW 2020: compact without compromises, extremely smart! Winner of the GTI Award 2015. Find our products ? https://www.kurtzersa.com/electronics-production-equipment/soldering-machines/select
The little big one from Ersa in selective soldering - SMARTFLOW 2020: compact without compromises, extremely smart! Winner of the GTI Award 2015. Find our products ? https://www.kurtzersa.com/electronics-production-equipment/soldering-machines/select
Heller Industries Inc. | https://hellerindustries.com/award/2020-global-surface-mount-technology-soldering-equipment-company-of-the-year-award/
. If these companies cannot meet high-demand volume efficiently, customers will suffer and lose confidence in them. As an established leader, manufacturer, and pioneer in the surface mount technology reflow soldering oven market, Heller Industries continues to excel through its continuous innovation and customer-centric mindset
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/connectors
. Some connectors may suffer from wear due to these repeated operations, so it is important to know how many cycles of insertion and withdrawal a USB connector design can sustain without a degradation
