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Electronics Forum | Tue May 27 11:59:14 EDT 2003 | blnorman
Is anyone aware of any reports, studies, articles on the subject of silicon contamination in SnPb solder joints. We are evaluating repair of conformally coated (silicone) boards. The fear is that we will never totally remove the silicone and once i
Electronics Forum | Tue Jan 29 13:06:40 EST 2002 | Sergio Vito - Alan Patrick - Cristiano Dick
Dear sirs, We are experiencing problems with lines of lead formed inside the solder joint. In others words, there is a problem with the formation of the solder joint, after analyses on a microscope we can see the lead grouped in some positions. This
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2003-06-23 08:49:39.0
Three Organizations from the US, Europe and Japan to
Technical Library | 2019-09-03 17:06:09.0
Both optical and scanning electron microscopy (SEM) are powerful tools for failure analysis in electronics and are used for low and high magnification examination. This article will provide detailed, step by step information for examining solder joints.
Technical Library | 2014-06-19 18:13:23.0
For high-density electronic packaging,the application of flip-chip solder joints has been well received in the microelectronics industry. High-lead(Pb) solders such as Sn5Pb95 are presently granted immunity from the RoHS requirements for their use in high-end flip-chip devices, especially in military applications. In flip-chip technology for consumer electronic products, organic substrates have replaced ceramic substrates due to the demand for less weight and low cost. However, the liquidus temperatures of high-Pb solders are over 300°C which would damage organic substrates during reflow because of the low glass transition temperature. To overcome this difficulty, the composite solder approach was developed...
Hear what attendees had to say about the Electronics in Harsh Environments Conference. Start planning your participation for the 2020 event: 21-23 April 2020 | Amsterdam, Netherlands https://www.smta.org/harsh
Welcome to this Defect of the Month video on head in and on pillow, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the last couple of years there hav
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Tue Apr 21 00:00:00 EDT 2020 - Thu Apr 23 00:00:00 EDT 2020 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference
Events Calendar | Tue May 17 00:00:00 EDT 2022 - Thu May 19 00:00:00 EDT 2022 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference and Exhibition
SMTnet Express, July 16, 2015, Subscribers: 23,036, Members: Companies: 14,463, Users: 38,550 Testing Printed Circuit Boards for Creep Corrosion in Flowers of Sulfur Chamber iNEMI (International Electronics Manufacturing Initiative) Qualification
SMTnet Express, March 17, 2022, Subscribers: 25,805, Companies: 11,547, Users: 27,113 Creep Corrosion On Lead-Free Printed Circuit Boards In High Sulfur Environments The material and process changes required to eliminate lead from
| https://www.eptac.com/webinar/addressing-the-issues-around-solder-joint-voids-in-surface-mount-components/
Addressing the Issues Around Solder Joint Voids in Surface Mount Components | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
Vacuum Reflow Processing On Solder Joint Voiding To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL
