Electronics Forum | Mon Jan 04 11:32:59 EST 1999 | Chrys
| Anyone have any experience with ECD's Waverider/MOLE profiling equipment? If so, were they positive experiences? | I use ECD's mole for profiling in the wave and a KIC for profiling in reflow. I like the KIC a whole lot better for a couple of re
Electronics Forum | Mon Jan 04 22:59:23 EST 1999 | Kris Ewen
I'd like to add something about the ECD product. During a past work term (I'm a a co-op student) in an SMA plant, I worked extensively with the Super MOLE Gold in developing the reflow profiles for high-mix, low-volume production. I was 'married' t
Electronics Forum | Thu May 18 20:42:36 EDT 2006 | davef
Hypothesis #1: We agree with Steve. You are probably seeing the nickel underplate. The gold was absorbed into the solder in portions of a second, so that you don't see it is not surprising. We're guessing that the gold was porous and allowed the n
Electronics Forum | Thu Sep 17 10:45:27 EDT 1998 | Justin Medernach
| We have problems with voids when we solder lids to | ceramic flatpackages. | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | The solder is attached to the lid (preform) and the solder material
Electronics Forum | Fri Sep 18 08:49:12 EDT 1998 | Earl Moon
| | We have problems with voids when we solder lids to | | ceramic flatpackages. | | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | | The solder is attached to the lid (preform) and the solder
Electronics Forum | Fri Sep 09 18:19:25 EDT 2011 | cusackmusic
First of all, if you are going to tell me to throw my crappy equipment away, and buy a better oven because 3 zones isn't enough for lead free soldering, please find another thread to troll in. We have been using a Hotflow 3 for several years for lea
Electronics Forum | Tue Sep 28 19:22:48 EDT 2021 | kumarb
Hi. Aside from the good advice above, wish to throw in our experience with our 1809EXL. Had < 200 on-hours and the oven would not melt the assorted fresh paste we sourced from different suppliers. The s/w reported that the set temps were being
Electronics Forum | Tue Jul 28 02:22:59 EDT 1998 | Bob Willis
Here is what I would do faced with your problem. First I would profile a similar board or use an existing profile. From there I would place the dummy device on the surface of a sample board with a thin thermocouple soldered to the board surface under
Electronics Forum | Tue Jul 28 09:15:49 EDT 1998 | Justin Medernach
| We are about to run our first BGA devices and would appreciate some confirmation on a few points. | First some details: | PCB & Device: | ============= | 1) 16 layer (4 power, 4 gnd, 8 signal) | 2) gold on nickel finish | 3) ceramic BGA with eutec
Electronics Forum | Tue Jul 28 17:23:58 EDT 1998 | Robert Steltman
| | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | | First some details: | | PCB & Device: | | ============= | | 1) 16 layer (4 power, 4 gnd, 8 signal) | | 2) gold on nickel finish | | 3) ceramic
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