Electronics Forum: surface and mount and technology (Page 1 of 7)

wave soldering surface mount tantalum and ceramic capacitors

Electronics Forum | Thu Feb 04 09:09:07 EST 1999 | dave

Can anyone help me with the pros and cons of trying to wave solder tantalum and large (1812) ceramic capacitors. I do know that one may see fractures on larger cermaic caps, but have not seen much on the tantalums. Any insight as to what problems I c

Re: wave soldering surface mount tantalum and ceramic capacitors

Electronics Forum | Fri Feb 05 09:39:58 EST 1999 | Dave F

| Can anyone help me with the pros and cons of trying to wave | solder tantalum and large (1812) ceramic capacitors. I do | know that one may see fractures on larger cermaic caps, but have not seen much on the tantalums. Any insight as to what proble

Re: wave soldering surface mount tantalum and ceramic capacitors

Electronics Forum | Tue Feb 16 16:28:30 EST 1999 | Tuffty

| | Can anyone help me with the pros and cons of trying to wave | | solder tantalum and large (1812) ceramic capacitors. I do | | know that one may see fractures on larger cermaic caps, but have not seen much on the tantalums. Any insight as to what

BGA and PGA

Electronics Forum | Sat Jul 29 09:10:16 EDT 2006 | davef

Ball Grid Array (BGA). A surface mount technology leadless package with the connectors to the board placed in an array on the bottom of the package. They are attached to the board with tiny balls of solder placed on each contact. Pin Grid Array (P

Matrix/Jedec tray changeover at pick and place surface mount.

Electronics Forum | Tue Oct 12 13:03:18 EDT 2021 | cunningham

Afternoon all, Do you use any special surface other that ESD matting when changing over matrix trays? We currently use a earthed wire trolley that we keep trays and MSD bags on and when replenishing stock its carried out on the trolley. Does anyon

Re: Intelliplace and Europlacer

Electronics Forum | Thu Dec 03 11:01:03 EST 1998 | Walter Cole

Hi Scott, I am a regional manager for Multitroniks and would be glad to assist you with additional information on the systems you are asking about. Both of these machines can be demonstrated for you any time at our factory in Warren, NJ. Below I'l

Conductive Adhesives and flip chip

Electronics Forum | Thu Feb 12 21:30:45 EST 2004 | davef

Comments are: * We're amazed that you can thermocompression bond to epoxy. * Silver may be oxidizing during expoxy cure. * Klein Wassink talks about aging in THE BOOK [Soldering in Electronics: A Comprehensive Treatise on Soldering Technology for Sur

tape and reel vendor

Electronics Forum | Wed Mar 10 11:43:11 EST 2004 | Bill Aldeen

My name is Bill Aldeen, and I own and operate Nu-Way Electronics, Inc. We provide Tape & Reel packaging service for surface mount and through-hole electronic components. We're in the Chicago area, and we serve all of North America competitively. W

Re: IPC and Nepcon

Electronics Forum | Wed Nov 18 14:42:22 EST 1998 | Dave F

| I heard somewhere that SMEMA has joined IPC, and that the association has decided to boycott Nepcon from | year 2000. Can anyone tell me if this is true | Nick: SMEMA and IPC are talking about merging (EP&P, 11/98, p 18). Below is a news release

Re: Palladium Pillows and Bad Dreams

Electronics Forum | Wed Feb 25 09:40:31 EST 1998 | Doug Romm

Steve, TI does not produce any SOTs using Palladium finish leadframes. I would certainly be interested to know who is. Also, your observations are correct: In TI experience the mechanical strength of the solder joints with Pd finish ICs is alw

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