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A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Electronics Forum | Fri Apr 18 15:38:22 EDT 2008 | ck_the_flip
Do you have a picture? SMTNet HAS the technology now to post pictures. "Disturbed" to the typical Q.E. usually means grainy or dull, or a wrinkly solder appearance. All of this has to do with the "grain structure" of the solder joint. Here's a p
Electronics Forum | Tue Apr 13 03:13:31 EDT 1999 | Mun-Cheol, Choi
Hello. I'm now investigating the current technological issues on surface mount devices. For example, I want to know the limitation of the surface mount machine. Where can I get the materials for this purpose? Thank you
Used SMT Equipment | SMT Equipment
JUKI JX-300LED Surface Mount Machine Laser identification: 0603- length of 33.5MM square element laser head *1 (6 nozzle) Can be corresponding to the length of 1500MM substrate production JUKI to boast of laser recognition technology to achieve h
Used SMT Equipment | SMT Equipment
JUKI KE-2070 surface mounting machine element size: laser recognition (0402 imperial 01005) chip to 33.5mm element image recognition: Mount 1.0 x 0.5 mm ~ 33.5mm element mounted speed: optimum conditions of 0.155 seconds / chip 23300CPH IC: prec
Industry News | 2020-11-03 18:16:39.0
2020 Global Surface Mount Technology Company Of The Year Award (Soldering Equipment)
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Parts & Supplies | Pick and Place/Feeders
(IN STOCK FOR SALE) Feature : JUKI Zevatech SMD SMT Component Feeder. Part Number: SFN1AS Part Name: Stick Feeder Rating: 7.2mm Lane Specifications: For JUKI ZEVATECH KE-2010 KE-2020 KE-2030 KE-2040 KE-2050 KE-2060 KE-2070 KE-2080 KE-1070
Parts & Supplies | Pick and Place/Feeders
Feature : SAMSUNG SMD SMT Spare Part. Part Name: Non-stop PB Type Mechanical Feeder. Rating:8x4mm For Samsung Techwin CP20 CP22 CP30 CP33 CP40 CP40CV CP40LV CP45 CP45F CP45FV CP45NEO CP50 CP60 Surface Mount Technology Equipment Brand : SAMSUN
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Training Courses | | | IPC J-STD-001 Specialist (CIS) Recert.
The Certified IPC J-STD-001 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC J-STD-001 Specialists.
Training Courses | | | IPC-A-610 Specialist (CIS) Recert.
The Certified IPC-A-610 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC-A-610 Specialists.
Events Calendar | Fri Sep 08 00:00:00 EDT 2023 - Fri Sep 08 00:00:00 EDT 2023 | Chihuahua, Mexico
I.C.T Boosts Technological Advancements: Sponsors SMTA Exhibition in Mexico
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Career Center | Raleigh, North Carolina USA | Engineering
Surface Mount Technology Engineer with minimum of 5 years experience in electronic assembly, engineering, process engineering in an electronics manufacturing environment. Some of this experience needs to be with Fuji equipment. Please submit resume
Career Center | Chicago, Illinois USA | Engineering
We are looking for a Degreed Manufacturing Engineer that has 1-2 years of experience dealing with Surface Mount Technology. We are a manufacturer of Electronic Components that include Connectors, Switches and things of that nature. Full time positio
Career Center | Raymond, USA | Engineering,Maintenance,Management,Production,Technical Support
Expert knowledge of circuit board manufacturing for the through-hole and Surface Mount Technology industry, international and national field work to manufacturers. Provided high value technical assistance and formal training to industry standards. Sp
Career Center | , New Jersey USA | Engineering,Management,Production,Research and Development
A highly experienced Engineering/Manufacturing Manager with 40 years of experience in electronic/mechanical design and manufacturing. Recent years, specializing in electronic manufacturing with emphasis on Surface Mount Technology. Currently employed
Solder Charge Grid Array: Advancements In The Technology Of Surface Mount Area Array Solder Joint Attachment Solder Charge Grid Array: Advancements In The Technology Of Surface Mount Area Array Solder Joint Attachment by: Jim Hines, Adam Stanczak
Surface Mount Technology Association (SMTA) | https://www.smta.org/forgot_password.cfm
SMTA - Surface Mount Technology Association 中文 MEMBERS LOGIN Membership Become a Member! Renew Membership About SMTA Ambassadors Benefits Classifications Member Directory Member Directory Corporate Suppliers Corporate Users Consultants List Advertisers Update Your Info
Imagineering, Inc. | https://www.pcbnet.com/blog/advantages-of-surface-mount-technology/
Advantages of Surface Mount Technology | Imagineering, Inc. Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances Certifications
Capital Equipment Solutions - SMT | PCBA | TEST
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