Refurbished Yamaha YV100X Pick and Place Machine MC Type YV100X PCB size L460 x W445 mm (Max.), L50 x W50 mm (Min.)or L460 x W335 mm Accuracy +-0.1 mm(Chips), +-0.08 mm Mounting Speed 0.198 sec/chips
Refurbished Yamaha YV100 ll Pick and Place Machine Machine Type Automatic pick and place Brand Name Yamaha Machine Model YV100II Cycle Time Mix Comp. (Ideal) 0.198sec/chip CPH 12000 Ideal (
Electronics Forum | Tue May 26 15:39:16 EDT 2009 | mikesewell
Amkor's MLF guidelines are very similar to Actels. 1 to 1 on the stencil to part pad on the I/O pads, 75% with a grid windowpane, 0.125 mm/5 mil stencil. For example, the Actel area ratio for a 0.3 mm sq. pad and 0.125 mm stencil is 0.6 which seems
Electronics Forum | Tue May 18 16:40:22 EDT 2010 | m79d
I am having some problems getting the IP1 to place a SSOP28 package,pitch 0.65mm lead width 0.3mm. I am selecting computer vision 012 (tried 011) and vision type 100. EL data was put in looking at the datasheet and also measuring the device. Have tri
Used SMT Equipment | Pick and Place/Feeders
Yamaha YV100ll pick and place machine Product name: YV100 Ⅱ YAMAHAmulti-functional chip mounter Product number: YV100 Ⅱ Products in detail YAMAHA multi-function chip mounter YAMAHA YV100II The brand YAMAHA model YV100 - II Automatic manua
Used SMT Equipment | Pick and Place/Feeders
Samsung Samsung CP45FV-Neo advantages: 1, simple operation, flexible line change: Samsung's CP and SM series Mounter is recognized by the industry's most simple operation of the model, which uses WinXP system, compatible with Gerb files,
Industry News | 2018-01-28 19:18:11.0
MIRTEC, “The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1327 at the 2018 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place February 27th- March 1st, 2018 at the San Diego Convention Center.
Industry News | 2018-03-22 21:11:24.0
Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.
Parts & Supplies | Other Equipment
Juki KE2050, KE2060, FX-1, FX-3 P/N: E3665X-729-0A0 Des: Nozzle,#500 (0.5×1.0) P/N: #501 Des: Nozzle,#501 (0.7×0.4 / 0.25 Holes) P/N: #502 Des: Nozzle,#502 (0.7/0.35) P/N: #503 Des: Nozzle,#503 (1.0/0.6) P/N: E3656-729-0A0 Des: No
Parts & Supplies | SMT Equipment
YAMAHA SMT NOZZLE for YG100B and YG100R Part Number Description 0.65×0.35 for 0603 0.65×0.35 for 0603 Tip KGS-M7710-A0X 211A 0.8×0.7 (X) 211A 0.8×0.7 (X) Tip KGS-M7720-A0X 212A 1.7×1.0 (X) 212A 1.7×1.0 (X) Tip KGS-M7730-A0X
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
Technical Library | 2022-12-05 16:28:06.0
The work evaluates the impact of latent heat (LH) absorbed or released by a solder alloy during melting or solidification, respectively, on changes of dimensions of materials surrounding of the solder alloy. Our sample comprises a small printed circuit board (PCB) with a blind via filled with lead-free alloy SAC305. Differential scanning calorimetry (DSC) was employed to obtain the amount of LH per mass and a thermomechanical analyzer was used to measure the thermally induced deformation. A plateau during melting and a peak during solidification were detected during the course of dimension change. The peak height reached 1.6 μm in the place of the heat source and 0.3 μm in the distance of 3 mm from the source. The data measured during solidification was compared to a numerical model based on the finite element method. An excellent quantitative agreement was observed which confirms that the transient expansion of PCB during cooling can be explained by the release of LH from the solder alloy during solidification. Our results have important implications for the design of PCB assemblies where the contribution of recalescence to thermal stress can lead to solder joint failure.
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/efd/products/reservoirs-and-pumps/analog-gauge-fluid-reservoirs
. Verfügbare Optionen 1 Liter (0,3 Gallonen) 5 Liter (1 Gallone) Serie 615 1 Liter (0,3 Gallonen) für Flaschen mit einem Fassungsvermögen von 1 Pfund/1 Liter; wird nur für
KD Electronics Ltd. | http://www.kundasmt.com/?A-Equipment-Accessories/6008.html
-VALVE 03004680-01 AIR PRESSURE FILTER 3/4 5um 03004683-01 PRESSURE REGULATING 1/4 0,3-10 bar 03004699-01 3/2-VALVE 1/8 V60A413A-A3000 03004703-02 OPERATORS CONTROL START/STOP/HOOD 03004704-01 OPERATORS CONTROL START/STOP/EMERGENCY O 03004714-03 Hand guard
