Electronics Forum | Sat Dec 24 07:48:52 EST 2005 | ams_gen
Hello, I need to rework a thru hole DIP mounted on a metal backed FR4. It is difficult to remove the FR4 board from the metal back since it is riveted. Is there a simpler way to takle this? Thnx
Electronics Forum | Thu Sep 06 22:49:35 EDT 2018 | cmchoue
Dear davef, All of this are takling about how to improve release solder paste, Area ratio, aspect ratio...etc, but i want to learn the "When design BGA stencil which the safe air gap between solder paste in difference stencil thickness", this can he
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