Industry News | 2017-01-11 18:22:38.0
MIRTEC, “The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #3101 at the 2017 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 14-16, 2017 at the San Diego Convention Center.
Industry News | 2020-01-06 16:06:59.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1900 at the 2020 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 4-6, 2020 at the San Diego Convention Center.
Industry News | 2012-10-09 16:13:23.0
Industry-leading associations IPC and SMTA jointly announce the agenda for Session 1 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.
Industry News | 2010-09-20 19:36:19.0
Industry-leading associations IPC and SMTA jointly announce the agenda for Session 1 of the High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, Illinois.
Industry News | 2011-06-24 19:39:13.0
The SMTA is pleased to announce that the program for SMTA International is finalized and available on-line at www.smta.org/smtai and registration is open. The conference will be held at the Fort Worth Convention Center in Fort Worth, TX on October 16-20, 2011. This year's program allows the attendee to choose from 21 courses, 130 technical papers, 4 focused symposia, and numerous free offerings throughout the conference.
Industry News | 2013-04-02 17:20:44.0
The SMTA is pleased to announce the program for the 2013 International Conference on Soldering and Reliability being held May 14-17 in Toronto, Ontario, Canada.
Industry News | 2013-07-19 11:27:23.0
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 10th Annual International Wafer-Level Packaging Conference.
Industry News | 2015-08-16 09:43:18.0
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 12th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 13-15, 2015 at the DoubleTree Airport Hotel in San Jose, California. Registration is now available online and Early Bird conference pricing is in effect until September 25, 2015, after which registration prices will go up $100.
Industry News | 2013-09-16 14:19:30.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) is delighted to announce that Evstatin Krastev, Ph.D., partnered with Zhen (Jane) Feng, Ph. D., Tho Vu, Michael Xie, David A. Geiger and Murad Kurwa of FLEXTRONICS International Inc., and Zohair Mehkri of Santa Clara University, will be presenting their paper titled, “2D/3D X-Ray Inspection: Process Control and Development Tool” during technical session PRC2 Imaging, Inspection and Quality at the upcoming SMTA International in Fort Worth Texas.
Industry News | 2022-03-22 16:06:45.0
XJTAG®, a leader in JTAG boundary scan products, announces a new software release that speeds up the development and debugging of boundary scan setups, and also helps to stop production line operators being distracted by too much information when they run tests.
