New SMT Equipment: technologies 20c (316)

Nozzle 2.5 for Fuji NXT H08/H12/V12 head

Nozzle 2.5 for Fuji NXT H08/H12/V12 head

New Equipment | Pick & Place

NXT Nozzle 2.5, Fuji NXT H08/H12/V12 head nozzle Dia. 2.5mm, R07-025-070, Part number: AA20C00.

YDA TECHNOLOGY LIMITED

First Digital Humidity Sensor!

First Digital Humidity Sensor!

New Equipment |  

Sensirion presents the world with the first digital humidity and temperature sensor. The tiny SMD sensor module (mass: 7.5 x 5 x 2.5mm, Lx W x H) transmits a calibrated digital signal to measure the relative humidity and temperature. In addition, ow

Sensirion

Electronics Forum: technologies 20c (2)

Solder wetting to ENIG pads

Electronics Forum | Tue May 13 08:26:29 EDT 2008 | davef

First, on your reflow temperature comment: The 183*C focus for reflow recipes for tin-lead solder is a falicy. If you held a recipe for tin-lead solder at 183*C peak, it would never reflow. Recipes for tin-lead solder need to be at liquidus plus 20*C

Re: Double sided reflow

Electronics Forum | Fri Feb 13 08:54:43 EST 1998 | justin medernach

| Hi , | I have not been able to find any good description on how to perform double sided reflow on PCBs.The best would of course be to avoid reflowing the bottom side again but in real life this is not possible. | So when double sided reflow sol

Industry News: technologies 20c (10)

NEPCON China 2008 - FINEPLACER�Lambda

Industry News | 2008-04-07 21:09:26.0

FINETECH announces that it will display the FINEPLACER� Lambda system at the upcoming NEPCON China 2008 trade show and exhibition, scheduled to take place April 8 to 11, 2008, in Shanghai, China. This high precision bonder provides a placement accuracy of � 0.5 micron.

Finetech

ADLINK Sets a New Standard for Fanless Embedded Computing With Outstanding Performance, Manageability and Ruggedized Design

Industry News | 2014-01-27 23:30:28.0

ADLINK Technology announced its new Matrix MXE-5400 fanless embedded computer with industry-leading performance, based on 4th Gen Intel® Core™ i7-4700EQ quad-core processor. The MXE-5400 delivers outstanding performance, excellent manageability, optimized connectivity, and rugged design in a compact package.

ADLINK Technology, Inc.

Parts & Supplies: technologies 20c (43)

Fuji Replacement Parts Head M Nozzle For Surface Mounted Technology Machine

Fuji Replacement Parts Head M Nozzle For Surface Mounted Technology Machine

Parts & Supplies | Assembly Accessories

Original New FUJI NXT H08 H12 M NOZZLE FOR Surface Mounted Technology Machine Nozzle Specifications: Brand Name FUJI NXT NOZZLE Part number Model M Size Guarantee 1 month Country Of Origin Japan FUJI NXT NOZZLES NOZZLE SIZE H08/H12 H0

KingFei SMT Tech

Fuji FUJI NXT placement machine display

Fuji FUJI NXT placement machine display

Parts & Supplies | Pick and Place/Feeders

FUJI NXT placement machine display FUJI NXT H08/12 0.3 FUJI   NXT H08/12 0.3 FUJI NXT H08/12 0.4 FUJI AA056 NXT H08/12 0.4 FUJI NXT H08/12 0.5 FUJI   NXT H08/12 0.5 FUJI NXT H08/12 0.7 FUJI AA057 NXT H08/12 0.7 FUJI NXT H08

ZK Electronic Technology Co., Limited

Videos: technologies 20c (9)

Testing Machine

Testing Machine

Videos

PLG series Computer Control Resonant High Frequency Fatigue Testing Machine   Application: Electromagnetic resonance High-frequency fatigue testing machine has simple structure, convenient operation, high efficiency, low energy consumption and othe

Jinan Scientific Test Technology Co., Ltd.

TI New and Original TPS563200DDCR in Stock  IC SOT23-6 21+    package

TI New and Original TPS563200DDCR in Stock IC SOT23-6 21+ package

Videos

TI New and Original TPS563200DDCR in Stock  IC SOT23-6 21+    package TPS563200DDCR  17V Input, 3A Synchronous Buck Regulator with Advanced Eco-Mode™ in SOT-23 Package LMZ14202HTZ/NOPB TO-PMOD-7 TI 22+ DS90CR288AMTD TSSOP56 TI 22+ XCF32PFSG48C BG

Shenzhen Fuwo Technology Co.,Ltd

Express Newsletter: technologies 20c (1022)

SMT Express, Issue No. 5 - from SMTnet.com

SMT Express, Issue No. 5 - from SMTnet.com Volume 1, Issue No. 5 Wednesday, October 13, 1999 Featured Article Return to Front Page A New Light-Weight Electronic Packaging Technology Based On Spray-Formed Silicon-Aluminiumby David M. Jacobson


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