Industry News | 2013-05-06 18:51:34.0
ZESTRON, , is pleased to announce that ZESTRON will be exhibiting at the SMTA Oregon Symposium & Supplier Days at the Hilton Bellevue in Seattle, WA, on May 7th and at Tektronix in Beaverton, OR, on May 9th.
Industry News | 2014-05-06 17:57:58.0
ZESTRON will be exhibiting the ZESTRON® EYE at the Atlanta 18th Annual Expo and the SMTA Oregon Expo and Tech Forum.
Industry News | 2015-05-04 20:15:12.0
ZESTRON will be exhibiting the latest in pH neutral cleaning solutions at the SMTA Michigan and SMTA Oregon Expo and Tech Forum.
Industry News | 2016-11-10 20:24:06.0
Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), the global leader in dispensing, jetting, and coating equipment and technologies, welcomes two distributors to provide sales, service, and support for Nordson ASYMTEK's fluid dispensing, jetting, and conformal coating equipment to customers in Switzerland. eXelsius® will manage the French-speaking areas of Switzerland (cantons: Genève, Jura, Neuchâtel et Vaud) while neutec electronic ag will manage the German and Italian-speaking areas and share responsibilities for Berne, Fribourg, and Valais.
Industry News | 2014-09-06 19:53:46.0
Metcal today announced that Ed Zamborsky, Eastern Regional Sales Manager, will speak at the Best Practices Workshop presented by Stanley Supply & Services and RESTronics.
Industry News | 2013-05-07 14:32:34.0
Creation Technologies, a leading electronics design and manufacturing provider, will be showcased at the 2013 SMTA Symposium & Supplier Days. The exhibit runs on May 7, 2013 at the Bellevue Hilton in Seattle, Washington and is hosted on May 9, 2013 in Beaverton, Oregon at the Tektronix facility.
Oriental Motor USA Corp.
Industry News | 2001-11-20 17:20:21.0
From Oriental Motor USA Corp
Industry News | 2015-10-13 19:27:42.0
SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void (
Industry News | 2016-07-07 14:47:47.0
SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance. The world’s largest IC Packaging and Test Service OSAT utilize SHENMAO Bumping Solder Paste in production.
