New Equipment | Assembly Services
G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function
PCB depaneling often happen right after SMT processing or after soldering,or after in-circuit test in the assembly line.PCB depaneling machine to be a important equipment in high-volume electronics assembly production. To choose the ASCEN PCB de
Electronics Forum | Wed Apr 11 19:32:39 EDT 2001 | Adam
I'm trying to find information/articles describing the effects of temp and humidity on solder paste. Just recently we have gone through a change outside temperature and humdidty and have notice solderabilty problems with smt boards.
Electronics Forum | Wed Apr 11 22:05:58 EDT 2001 | davef
OA pastes are more hydroscopic than NC pastes. Hydroscopic. The capacity of a material to absorb and retain moisture from the ambient air. Sometimes this is compounded if you remove paste from the frig and let it warm to room temperature, because
Industry News | 2023-04-11 09:52:04.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems at SMTconnect, scheduled to take place May 9-11, 2023 in Nuremberg, Germany. The company will showcase a total of five (5) Inspection Systems specifically designed to address the full spectrum of inspection requirements associated with the electronics manufacturing industry in Hall 4A, Stand 128.
Industry News | 2020-06-30 15:07:32.0
MIRTEC is excited to announce its participation in an exclusive ONLINE CONFERENCE & EXPO. The event will be broadcast live on Wednesday, July 8, 2020 from 10 a.m. - 2:30 p.m. EST and will include a full program of live presentations, interviews and special guests.
SMTnet Express, August 26, 2021, Subscribers: 26,759, Companies: 11,431, Users: 26,816 Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding
Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. The purpose
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/
. Humidity – Moisture has increasingly become one of the biggest issues for printed circuit board manufacturers today. Aside from the popcorn effect and microscopic cracking, it can also cause solder balls to form due to escaping air or water
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
. Hence, an optimum combination of peak temperature and time above liquidus is important to achieve a good solder joint. The purpose of this experiment is to study the effect of the reflow peak temperature and time above liquidus on solder joint shear force
WINTECH provides new/used/pre-owned SMT, AI & PCB Assembly (PCBA) equipment of various brands. Also supply service, modification & original or local-made spare parts. We are also an appointed agent for well-known brands.
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PERAI, Malaysia
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