Electronics Forum | Sat Nov 03 11:08:24 EDT 2012 | anvil1021
We have experience with this alloy, but with enig and we did start with PB HASL, none of our PCBs would of course pass thermal cycling at normal temperatures with the HASL so we went to ENIG. we could thermal cycle at 100-115C with no issues. We foun
Electronics Forum | Fri Dec 17 13:23:15 EST 1999 | Chris
I have an underfill material which takes 6 hours to cure. It works great, better than any other underfill I have ever used. A vertical cure oven is too expensive. I am currently using batch style ovens and opening the oven door as additional produ
Electronics Forum | Tue Feb 08 14:49:23 EST 2000 | Travis Slaughter
I have never tried this and wouldn�t really even want to consider it. Epoxy generally cures at around 160c in a fairly short amount of time, solder paste requires much more time and a peek temperature of about 210c or more in some cases. Curing you
Electronics Forum | Fri Oct 30 15:09:44 EST 1998 | ChungPark
| Dear all, | | What are your views on reworking BGA's? I mean, with the BGA going through reflow temperatures four times or more, and with a manual reballing process, wouldn't it raise up a few reliability issues? Would you consider not doing rew
Electronics Forum | Mon Jun 08 14:19:30 EDT 1998 | Gary Simbulan
Earl, et al, Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. First the caps. We still have
Electronics Forum | Thu Jan 24 09:53:56 EST 2002 | davef
You didn�t tell us about your solder, wave temperature profile, or the distribution of the problem. So, let�s assume the solder is near eutectic and the problem is wide spread. Wolfgang makes good points. So, let's talk a different tact. When we
Electronics Forum | Tue Aug 31 17:36:36 EDT 2004 | davef
NO-LEAD COMPONENTS WITH LEAD SOLDER ISSUE: We agree with Russ. We've dicussed this several times on SMTnet. For instance, look here http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=25394 LEAD COMPONENTS WITH NO-LEAD SOLDER ISSUE: We disa
Electronics Forum | Thu Sep 19 11:14:45 EDT 2002 | Jim M.
We had lots of problems with bridging on 15.8mm pitch, QFP17-160 at the start.The board was .032 thick, double sided-six boards to a panel. Here is the problems (not neccessarily in the biggest to little but as i remember them) and solutions that he
Electronics Forum | Tue Jun 16 15:01:58 EDT 1998 | Gary Simbulan
There are some common reason for capacitor cracking on my web page if you want to have a look. The document can be downloaded for your reference. | Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior
Electronics Forum | Mon Jun 08 14:52:16 EDT 1998 | Gary Simbulan
| Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. | First the caps. We stil
