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High Frequency PCB Material: SYTECH Layer Count: 4 layers PCB Thickness: 1.6mm Min. Trace / Space Outer: 0.1mm/0.1mm Min. Drilled Hole: 0.2mm Via Process: Tenting Vias Surface Finish: ENIG+OSP Product Features 1. DK needs to be tiny as well
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Thick-Copper PCB Material: Fr-4 Layer Count: 4 layers PCB Thickness: 1.4mm Min. Trace / Space Outer: 0.065mm Min. Drilled Hole: 0.2mm Via Process: Tenting Vias Surface Finish: ENIG Product Features Features: 1) Years of experience in half-
Electronics Forum | Fri Oct 05 07:31:29 EDT 2001 | furrer
When tenting vias almost a few vias are not covered completly by Solder Mask. Does this one side open vias affect the Immersion Tin Process ? Do we get chemical residues in the vias ?
Electronics Forum | Sat Oct 06 08:27:24 EDT 2001 | davef
Yes, some solder masks do not tent well, because the material is too thin. That�s the trade-off. Thin masks: * Conform well to [don't bleed onto] fine pitch features. * Tent vias poorly, requiring an additional "plugging" step. As you imply, if th
Industry News | 2019-11-05 22:07:01.0
Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.
Industry News | 2018-10-18 10:40:04.0
Via Tent-Holes with Solder Mask
Technical Library | 2019-05-29 01:47:22.0
1.Vias near SMD pads: Solder can flow into the via after melted. As a result cold joint will appear in the end. Check the picture below. 2.Vias on SMD pads: Solder can flow into the via more easier after melted. Check the picture below. 3.Via opening without soldermask covered. When workers solder TH parts by hand, soldering iron can touch vias sometime, then tiny amounts molten solder will stay on vias. This can lead to electrical short easily. We recommend you make all vias tenting (covered by solder mask) if it is possible.
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SMTnet Express, June 27, 2019, Subscribers: 32,092, Companies: 10,819, Users: 24,882 Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper Credits: MacDermid Inc. Copper-filled micro-vias are a key
40731 | https://www.smta.org/harsh/Harsh-Environments-Conference-2020-Sponsorships&Exhibits.pdf
Surface Mount Technology Association (SMTA)
Heller 公司 | http://hellerindustries.com.cn/00600-248.pdf
. The typical form for such a profile, Figure 1b, is commonly referred to as a “tent” or “straight ramp” profile. For no- clean pastes, which have less active fluxes, excessive dwell time serves only to deplete the flux before reflow
