Industry Directory | Equipment Dealer / Broker / Auctions
我们是一家来自中国的SMT供应商。我们长期供应SMT设备供料器及设备配件，包括松下、三星、雅马哈、富士、西门子、JUKI等。我们供应SMT吸嘴、SMT供料器、SMT机器。
Industry Directory | Manufacturer
A leader in automated fluid dispensing, jetting, and conformal coating. Products include stand-alone dispensing workstations and fully automated, in-line conveyorized systems with advanced process controls.
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Electronics Forum | Wed Dec 20 11:02:05 EST 2000 | LarryK
Does anyone know the terms or keywords for the following? PIH ECA CCA Thanks Larry
Electronics Forum | Thu Dec 30 12:17:19 EST 1999 | JAX
Marlies, The terms are one in the same but are used according to how you descibe the situation; i.e. centering refers to adjusting the part where as aligning normally deals with adjusting the vision. NOT THAT THIS IS A RULE. ( different strokes...
Used SMT Equipment | SPI / Solder Paste Inspection
Make: Viscom Model: S3088 Basic Vintage: 2016 Description: Solder Paste Inspection Condition: Complete & Operational Location: USA Availability: Immediate Shipping: EXW Origin Terms: 100% Prepay
Used SMT Equipment | Screen Printers
2013 Speedline MPM 125 Automatic Screen Printer Make: Speedline Model: MPM 125 Vintage: 2013 Description: Automatic Screen Printer Condition: Complete & Operational Location: USA Availability: December 2022 Shipping: EXW Origin Terms: 100% Prepay
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
Industry News | 2007-11-01 20:00:20.0
October 31, 2007, Florham Park, New Jersey � In continuation with its overall growth strategy, Heller Industries is pleased to announce the appointment of Mr. Wojtek Antoniak as Regional Sales Manager, Southeast Asia. Mr. Antoniak will be based in Singapore and will be responsible for sales management throughout Malaysia, Thailand, Vietnam as well as Singapore and the Philippines.
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Parts & Supplies | Screen Printers
Description: DEK system control power SMPSU, 650W WIDE RANGE I / P (FASTON TERMS) (TXT) Part NO.: 160555 Applicable models: ELA / HORIZON / INFINITY
Parts & Supplies | SMT Equipment
System Control Power (160555) Description: DEK system control power SMPSU, 650W WIDE RANGE I / P (FASTON TERMS) (TXT) Part NO.: 160555 Applicable models: ELA / HORIZON / INFINITY
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Training Courses | | | IPC-A-610 Trainer (CIT) Recert.
The Certified IPC-A-610 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC-A-610 Specialist (CIS) training.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Wed Apr 26 00:00:00 EDT 2017 - Wed Apr 26 00:00:00 EDT 2017 | Chicago, Illinois USA
IPC Reliability Forum: Manufacturing High-Performance Products
Events Calendar | Sat Jun 15 00:00:00 EDT 2019 - Thu Jun 20 00:00:00 EDT 2019 | Raleigh, North Carolina USA
IPC SummerCom
Career Center | Sandy, Utah USA | Production
Looking for an experienced electronics SMT Assembler for a Possible long term project. Please inquire for details Flexible time and hours available Call us
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: BSEE required, 7 years experience with Electric power system or Industrial system practices and experience leading technical teams. Duties/Functions: Function as both an Emgineer and Project Manager for short and long term busine
Career Center | Port Harcourt, Argentina | Management
Hold strong background in electronic repairs
Career Center | Round Rock, Texas USA | Management,Production,Purchasing
With Supply Chain and manufacturing management experience that includes startups, turnarounds and major growth initiatives for high-tech electronics firms, I have significant accomplishments in building and efficiently running companies. If your firm
SMTnet Express, March 3, 2022, Subscribers: 25,842, Companies: 11,529, Users: 27,083 Component Reliability After Long Term Storage Each year the semiconductor industry routes a significant volume of devices to recycling sites
SMTnet Express, October 16, 2014, Subscribers: 23409, Members: Companies: 14079, Users: 36964 Oxide Thickness and Solderability Methodology to Determine Long Term Storage of BGAs and QFPs. Rama Hegde, senior member of technical staff; Freescale
