Electronics Forum: tescon and ict (Page 1 of 7)

Dye and Pry

Electronics Forum | Mon Mar 17 03:50:12 EDT 2008 | Sean

Hi All, Besides the above question, I have another one as below: (1) How frequent that we need to perform strain gauge study on ICT, Functional test fixture? Is it a necessary to perform this study each time after ICT, Funtional test fixture preve

Conveyors and bar code

Electronics Forum | Thu Aug 24 16:08:18 EDT 2006 | Frank R.

Thanks Bill and Dave for your help, Sorry Dave if I didn't search for information in archives. After wave process we have 2 ICT, 2 AOI machines 4 PVA conformal coating machine that will be use on 3 different lines. The quind of automation I want to

No Clean and Underfill

Electronics Forum | Fri Mar 19 12:17:15 EDT 2010 | stepheniii

Be carefull if you go to no clean. Or be prepared from complaints from the test department regarding their ICT pins getting dirty.

BGA lands and ICT

Electronics Forum | Tue Mar 19 17:30:46 EST 2002 | rculpepp

Does anyone have or know of any published guidelines for BGA layout on PWB's so that they can be tested. Specifically using micro vias? If anyone has any input regarding other test considerations for BGA devices I'd like to hear from you as well. W

Lead Free and ICT

Electronics Forum | Tue May 09 14:49:57 EDT 2006 | Larry

Hey guys, Anybody having trouble with increased false contact issues in ICT after switching from lead to lead free? Our test guys keep trying to imply that the flux residues are a problem (we're using Alpha EF2202), but as the soldering process eng

Lead Free and ICT

Electronics Forum | Sat Jun 03 03:35:16 EDT 2006 | mika

Yes we do have a problem with this. We have by now investigate numerous lead/RoHS PCBA:s The RoHS boards are by far the most difficult one's to probe and test. Our people at the "test area" including Flying Probe and ICT they spend a lot of time to t

BGA lands and ICT

Electronics Forum | Wed Mar 20 07:57:30 EST 2002 | davef

Purchase: 7095 - Design and Assembly Process Implementation for BGA's Make every effort to distribute the test pads, because if you keep them massed at the ball, it would be a bijundo kick in the BGA rear section, when all of those pins released.

BGA lands and ICT

Electronics Forum | Wed Mar 20 15:18:09 EST 2002 | angiewest

You may want to check out IPC-SM-782 "Surface Mount Design and Land Pattern Standard" http://www.ipc.org Good Luck

Lead Free and ICT

Electronics Forum | Wed May 10 00:46:32 EDT 2006 | Chris

I agree! I am using a SAC305 no clean from Alpha. I have noticed that even hand probing with volt meter leads requires me to press very hard on the pads to bust through the flux residue.

PCBA board and probe

Electronics Forum | Sat Nov 13 03:10:36 EST 2021 | pti88

why poor contact between PCBA board and probe? When I used ICT to test PCBA board, there was poor contact between board and probe .

  1 2 3 4 5 6 7 Next

tescon and ict searches for Companies, Equipment, Machines, Suppliers & Information