New Equipment | Education/Training
The purpose of these courses is to promote best manufacturing practices and enhance the individual’s job performance. These courses are indispensable for everyone involved in Electronics Manufacturing. Blackfox is widely recognized in the industry fo
New Equipment | Assembly Services
Detailed introduction of 3D spi-6500 solder paste thickness gauge Product function 1. Friendly programming interface 2. Multiple measurement methods 3. The scanning distance is adjustable 4. 3D simulation function of image 5. Independent
Electronics Forum | Wed Dec 13 02:17:07 EST 2017 | am
Guys, What are the best effective tests methods to show capability and repeatability of reflow ovens and AOI machines?
Electronics Forum | Wed Dec 13 07:11:23 EST 2017 | emeto
ICT, Functional test and performance in the field.
Used SMT Equipment | General Purpose Test & Measurement
Optical Spectrum Analyzer Agilent 86140B Optical Spectrum Analyzer. Passes self test - no option. Built-in test applications, 10 pm wavelength accuracy, Fast dual-sweep method, Covers S, C, and L wavelength bands. SN# US40461075 Room 4C. SN# US40461
Used SMT Equipment | SMT Equipment
Product name: YG200 yamaha SMT medium speed chip mounter Product number: YG200 Products in detail Yamaha YG200 high-speed SMT machine Speed: 0.08 seconds/CHIP (IPC9850 conditions) 1608 CHIP: 34800 CPH (0.103 seconds/CHIP conversion) 16 pinso
Industry News | 2016-02-27 22:07:08.0
GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.
Industry News | 2003-03-10 08:41:03.0
provides an overview of the main features of both conduction coupling and radiated field coupling, the two primary RF immunity test methods.
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Parts & Supplies | Pick and Place/Feeders
How to do JUKI shaped component image？ 1: Master the type of the opposite sex component 2: Master pin or ball pitch, pin width, length and ball diameter 3: Recognition method: transmission, side, reflection 4: VCS TEST can be 5: For the
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2020-08-05 17:13:12.0
A primary issue in electronics reliability for military applications is the ability to ensure long term operability in harsh, extreme environments. This requires more rigid standards, such as the MIL-STD-883 (Department of Defense Test Method Standard for Microcircuits), which commercial grade electronics typically do not satisfy. A solution commonly employed is to package the critical electronic components in hermetically sealed metal or ceramic enclosures which are costly and labor intensive. Not only are the components more expensive, but the assembly process is more difficult to automate, resulting in a substantial cost premium for military grade electronics.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | IPC J-STD-001 Trainer (CIT)
The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.
Events Calendar | Mon Jun 08 00:00:00 EDT 2020 - Mon Jun 08 00:00:00 EDT 2020 | ,
Practical Set-Up, Qualification of Cleaning Process in PCB Assembly
Events Calendar | Mon Sep 14 00:00:00 EDT 2020 - Mon Sep 14 00:00:00 EDT 2020 | ,
Printed Circuit Board (PCB) Inspection & Quality Control
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | , | Engineering
Methode Electronics, Inc. seeks Quality Engineers experienced in testing and calibration; micro-controller based electronic assemblies, SPC, DOE. Send resumes to Methode Electronics, Inc. PO Box 130, Carthage, IL 62321 or email resumes@methode-aecd.c
Career Center | Damascus, Syria | Engineering,Maintenance,Production,Technical Support
Experience : 1- PCB Test Engineer For Telecom Products And TV - LCD Manufacturing as follow : - In-Circuit and Automatic Test Equipment Test - in-circtuit Emulator - Function Test - Automatic Optical Inspection Test - Toubleshooting Axial
Career Center | Appleton, Wisconsin USA | Engineering,Production,Research and Development,Technical Support
I have more than 25 years of experience in electronics manufacturing and printed circuit board (PCB) structural test. My forte is in-circuit test (ICT) program and fixture development and debug on the HP/Agilent 3070. I have more than 16 years of 3
SMTnet Express, February 7, 2019, Subscribers: 31,653, Companies: 10,704, Users: 25,698 High Frequency Dk and Df Test Methods Comparison High Density Packaging User Group (HDP) Project Credits: Oracle Corporation The High Density Packaging (HDP
| https://www.eptac.com/blog/3d-printing-creates-new-possibilities-for-pcb-manufacturing-methods
3D Printing Creates New Possibilities for PCB Manufacturing Methods Looking for solder training standards, manuals, kits, and more
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/creep-test
Creep test X-Ray Inspection and Test Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Bondtesting Systems Micro Materials Testing Wafer Inspection and Metrology X-ray Inspection Systems X-ray Counting Systems Applications Battery
