New Equipment | Test Equipment
Automated Optical Inspection Machine ZW 625 Dimension:900*1100*1350 mm Max PCB:430x330mm Inspection Component: 0201 chip Weight:Aprox. 450kg Product description: Automated Optical Inspection Machine,Max PCB:430x330mm,Inspection Component: 020
New Equipment | Test Equipment
Automated Optical Inspection Machine ZW 625 Dimension:900*1100*1350 mm Max PCB:430x330mm Inspection Component: 0201 chip Weight:Aprox. 450kg Product description: Automated Optical Inspection Machine,Max PCB:430x330mm,Inspection Component: 02
Electronics Forum | Thu Oct 14 06:27:45 EDT 2004 | davef
a disturbed solder joint. * Extended/slow cool down ramps can result in surface texture => grainy solder joint. Second, the "BGA scaling" could be a reflection of: * Too little heat (incomplete solidification) OR * Too much heat (excess grain growt
Electronics Forum | Fri Jun 25 11:29:43 EDT 2004 | tcp
We have had some field returns of a double sided SMT board manufactured in the February timeframe. The boards are encapsulated in an epoxy potting. When removing the potting some SSOP devices came off in the potting. The leads had pulled out of th
Industry News | 2010-04-23 21:51:55.0
BANNOCKBURN, Ill., USA — Celebrating the best of electronic interconnection research being conducted by both industry leaders and academia, IPC – Association Connecting Electronics Industries® announced the 2010 Best Industry Posters and the winners of the second annual IPC Academic Poster Competition at IPC APEX EXPO, held April 6–8, 2010 in Las Vegas.
Industry News | 2016-07-26 18:48:27.0
Viscom today announced plans to introduce its new 3D AOI line-up to Asian markets, highlighting its new 360View feature in Stand 1F35 at NEPCON South China, scheduled to take place Aug. 30-Sept. 1, 2016 at the Shenzhen Convention & Exhibition Centre.
The Future of Solder Joint Encapsulant Online Version SMTnet Express, January 14, 2016, Subscribers: 23,987, Members: Companies: 14,894, Users: 39,724 The Future of Solder Joint Encapsulant Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced
GPD Global | https://www.gpd-global.com/co_website/fluiddispense-appsol-flipchipassembly.php
. Accurate alignment of each die is necessary to keep the dispensed material within the allowed wetted areas. The alignment process can be very tricky when silicon dies are used because the surface texture and finish can vary from unit to unit or lot to lot
