Industry News: tg and td (Page 1 of 2)

Toddco General, Inc. TG-1000 Hot Bar Bonding System for large displays and substrates

Industry News | 2014-08-16 17:55:06.0

Toddco General, Inc. released the new TG-1000 bonding platform to easily support large display panels or other substrates requiring hot bar bonding of flexible circuits, TABs, COF or COG. Designed for process development labs, high-mix production or repair environments.

Toddco3

TG-1000 Hotbar Bonding System for Small Displays and Wearable Products

Industry News | 2017-05-26 14:54:11.0

Versatile Hotbar Bonding System with Motorized Rotary Table for Precision Positioning

Toddco3

ESA Exclusively Approves Ventec VT-901 material in ACB Belgium's HDI Rigid PCB qualification

Industry News | 2024-02-19 12:12:20.0

Ventec International Group Co., Ltd. (6672 TT) is pleased to announce that its VT-901 polyimide material is now fully and exclusively qualified by ESA in ACB Belgium's manufacture of High-Density Interconnect (HDI) Printed Circuit Boards. With this recently obtained ESA qualification, ACB is currently the only PCB manufacturer able to offer HDI technology within an ESA qualified domain.

Ventec International Group

Explore and Qualify for Lead-Free Assembly!

Industry News | 2004-02-04 16:52:03.0

Prepare for the 2006 European Deadline

Practical Components, Inc.

MacDermid Alpha to Launch ALPHA HiTechHigh Tg, Low CTEUnderfill and CornerfillBonding Materials

Industry News | 2021-01-17 17:50:26.0

The Assembly Division of MacDermid Alpha Electronics Solutions announces the release of ALPHA HiTechUnderfills and Cornerfills with high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. The attributes provide formulation flexibility to enhance product performance in various applications.

MacDermid Alpha Electronics Solutions

Practical Components and PACTECH Offer Flip Chip Test & Evaluation Kit and Board

Industry News | 2010-09-22 14:26:54.0

Practical Components Inc., a leading international national distributor of dummy SMD and thru-hole components, test boards, training/setup kits and supplies, announces a new PACTECH PCB310 Flip Chip Test & Evaluation Board for placement and daisy chain continuity testing after assembly.

Practical Components, Inc.

Raw Material Choices for PCBs

Industry News | 2018-10-18 11:10:33.0

Raw Material Choices for PCBs

Flason Electronic Co.,limited

Engineered Material Systems Releases Die Attach for Light Emitting Diodes and Small Power Semiconductor Devices

Industry News | 2012-02-15 19:12:30.0

Engineered Material Systems has released its new DA-5045-2 and DA-5045-4 High Thermal Conductivity Die Attach Adhesives for attaching light emitting diodes (LEDs) and small die.

Engineered Materials Systems, Inc.

Engineered Material Systems Introduces Low-Cost Jettable Conductive Adhesive for Photovoltaic Stringing and Bussing Applications

Industry News | 2013-06-24 10:34:13.0

Engineered Material Systems (EMS), debuts its CA-148 Jettable Conductive Adhesive for ribbon stringing and bussing in photovoltaic applications.

Engineered Materials Systems, Inc.

Differences Between Smart Pressure Transmitter and Analog Pressure Transmitter

Industry News | 2021-12-09 20:15:40.0

Pressure transmitter is composed of single chip microcomputer and micro displacement (differential) pressure sensitive element, which can complete multi-function detection and conversion from non electric quantity to electric quantity.

OKmarts Industrial Parts Mall

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