FR408 High Speed, Low Loss Modified Epoxy FR408 is a high-performance FR-4 modified epoxy laminate & prepreg system designed for advanced circuit applications. Its low dielectric constant and low dissipation factor make it an ideal candidate for br
BP 256 ball attach adhesives have been designed to enhance solder joint reliability and eliminate cleaning process for ball bumping process of CSP, BGA, Flip chip and PoP (package on package) and so on, particularly for lead free application. During
Electronics Forum | Wed Oct 11 21:55:27 EDT 2017 | action_101
I've used plenty of weights in the wave solder process, but not in the SMT reflow process. Ask yourself some why's.... such as why is the part lifting at one end? (board bowing possibly), why? Not the correct tg material or issue with oven profile? W
Electronics Forum | Thu Jan 19 20:40:52 EST 2006 | Gary Kemp
We are experiencing a blistering problem during our process of lead free assembly. The customer has supplied us with the bare fab rated at 140 Tg. I am under the assumption that the Tg rating should at minimum be 170. Does anyone know if there is
Industry News | 2010-12-17 01:47:04.0
IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.
Industry News | 2017-05-26 14:54:11.0
Versatile Hotbar Bonding System with Motorized Rotary Table for Precision Positioning
Technical Library | 2023-03-27 19:18:38.0
Electronic waste (e-waste) is currently the fastest growing hazardous waste stream that continues to be a challenging concern for the global environment and public health. The average useful life of electronic products has continued to decline, and obsolete products are being stored or discarded with increasing frequency. E-waste is hazardous, complex and expensive to treat in an environmentally sound manner. As a result, new challenges related to the management of e-waste have become apparent. Most electronic products contain a combination of hazardous materials, toxic materials, and valuable elements such as precious metals and rare earth elements. There are risks to human health associated with the disposal of E-waste in landfills, or treatment by incineration. Americans discard 400+ million electronic items per year recycling less than 20 percent in safe and sustainable manner. E-waste is exported from developed countries and processed informally using unsafe conditions in many regions of developing countries. A mixture of pollutants is released from these informal rudimentary operations. Exposure to e-waste recycling includes the dismantling of used electronics and the use of hydrometallurgical and pyrometallurgical processes, which emit toxic chemicals, to retrieve valuable components. Thermal analysis integrated with chromatographic and spectroscopic techniques are used to determine dangerous chemicals emitted during the burning of e-waste. The information is used to assess the risk of exposure of workers at these semi-formal recycling centers.
SMT256EP solderable adhesive is self-leveling and self-soldering adhesives, which has been designed for high temperature Pb-free application. By comparison with conductive adhesives (Ag), SMT256EP solderable adhesive has higher stable electrical and
http://yincae.com/index.html YINCAE SMT 256 Dipping Process YINCAE SMT 266 Jetting Process
Imagineering, Inc. | https://www.pcbnet.com/blog/high-temperature-pcb-considerations-for-high-heat-applications/
. IS410, IS420, and G200 are some well-known examples. High Temperature PCB Design Requires a High Degree of Expertise A higher Tg point equates to a higher temperature requirement during the lamination process, affecting both the printed circuit board
