ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/bondtesters/4600-automated-bondtester
– even with extreme height variations Compound Surface Imaging (CSI) scans through a Z-stack to get every point in focus Automatically return to the failure site to record an image Assists with failure mode analysis Comes as standard with every 4600 Bondtester
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