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Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Environmental testing is a very useful tool in ensuring product reliability. We have an environmental laboratory that can assist with every aspect of this testing. Our capabilities begin with test planning with the customer and proceed to execution
Electronics Forum | Fri Jan 04 14:21:35 EST 2008 | ck_the_flip
If all your doing is trying to measure oven repeatability, but then you wanna do it a bunch of times, have a profiling "board" constructed out of say... delmat, delrin, or some other glastic-type pallet material. Have the T/C's permanently fastene
Electronics Forum | Fri Jan 04 09:44:59 EST 2008 | philkaz
Hello, I am Philip Kazmierowicz and I work with KIC, a Thermal Profiling company. We have done many lifetime experiments on Printed Circuit Boards over the years. The key thing to understand is that if the primary material of the board in FR4 fiber
♣ IN-Like New Condition, Only Used Twice ♣ ◘ Split-Vision Optics with 1.3 Million Pixel HD Video Camera, Electronic Zoom Adjustment, and LED Lighting, Projects Superimposed Images of Component Leads and PCB Pads on 15" Full Color LCD Display.
Versaflow Selective soldering Selective Soldering Process Advantages: Better, Faster, Cleaner & Cheaper! . consistent LF solder joint quality & significant reduction of DPM . No re-melting of top side SMD components, as with wave soldering . PCB
Industry News | 2003-05-06 08:21:44.0
Will address key issues in the
This reflow oven is top quality oven represent the world's best low cost, high performance solder reflow sytem. The sensor is designed in the front of tip and the temperature induction is very exact and sensitive, the speed of heating and recovery of
FUJI CP6 CP642 CP643 CP65 WPH2030 WPH0903 FILTER FUJI CP6 WPA5152 Solenoid valve SPCHA7-25-12-Z3B Square cylinder WPA5152, SPCHA7-25-12-Z3B, CP6/CP643 square cylinder with valve WPA5142; WPH0870 WPH2130 WPH2120 vacuum valve pressure piece XP142
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Career Center | Sunnyvale, California USA | Engineering
Our client is a leading equipment supplier to electronic assemblers around the world. Responsibilities: Conduct technical analysis of product implementations, modifications and enhancements to product in accordance with specific customer specifi
Career Center | Charleston, South Carolina USA | Engineering,Maintenance
ELECTRICAL/ELECTRONICS ENGINEER II UEC is looking for an Electrical/Electronics II engineer who is motivated and enthusiastic about joining an engineering group which provides design and development of battery systems, power distribution systems,
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
SMTnet Express, August 17, 2017, Subscribers: 30,720, Companies: 10,649, Users: 23,665 The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability Richard Coyle, Richard Popowich, Charmaine Johnson - Nokia Bell
Partner for Life(cycle): NPI taken to a New Level - Whizz Systems Skip to content Partner for Life(cycle): NPI taken to a New Level Located in the heart of Silicon Valley, Whizz Systems provides electronics product design, development and manufacturing services
Weibull slopes. Failure Analysis The -55/125 °C thermal cycling test started substantially after the 0/100 °C test, and only samples from the 0/100 °C cycle were available for failure analysis at the time of this writing. Examples of void-assisted solder