Industry Directory: thermal cycle limit (25)

Heller Industries Inc.

Heller Industries Inc.

Industry Directory | Manufacturer

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

Surface Mount Technology Association (SMTA)

Surface Mount Technology Association (SMTA)

Industry Directory | Association / Non-Profit / Events Organizer / Training Provider

The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.

New SMT Equipment: thermal cycle limit (2636)

Vertical Curing Oven - Heller 788

Vertical Curing Oven - Heller 788

New Equipment | Curing Equipment

Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

Heller Industries Inc.

Unisoft CELLS - Product Tracking MES Software

Unisoft CELLS - Product Tracking MES Software

New Equipment | Software

Affordable Manufacturing Execution System (MES), Shop Floor Automation and Integration Software CELLS WORKFLOW Product Tracking MES is an affordable full Manufacturing Process Control Software System providing Plant Intelligence for any industry. 

UNISOFT Corporation

Electronics Forum: thermal cycle limit (478)

Prifiling Board life cycle

Electronics Forum | Fri Jan 04 14:21:35 EST 2008 | ck_the_flip

If all your doing is trying to measure oven repeatability, but then you wanna do it a bunch of times, have a profiling "board" constructed out of say... delmat, delrin, or some other glastic-type pallet material. Have the T/C's permanently fastene

Prifiling Board life cycle

Electronics Forum | Fri Jan 04 09:44:59 EST 2008 | philkaz

Hello, I am Philip Kazmierowicz and I work with KIC, a Thermal Profiling company. We have done many lifetime experiments on Printed Circuit Boards over the years. The key thing to understand is that if the primary material of the board in FR4 fiber

Used SMT Equipment: thermal cycle limit (28)

Manncorp BR790-HD BGA Rework Station

Manncorp BR790-HD BGA Rework Station

Used SMT Equipment | Repair/Rework

♣ IN-Like New Condition, Only Used Twice ♣ ◘ Split-Vision Optics with 1.3 Million Pixel HD Video Camera, Electronic Zoom Adjustment, and LED Lighting, Projects Superimposed Images of Component Leads and PCB Pads on 15" Full Color LCD Display.

World Equipment Source / R1 Source, Inc.

Universal Instruments 6412F

Used SMT Equipment | THT Equipment

Cycle Rate Max 25,000 cph (0.14 sec. per insertion) Reliability 200 ppm or better Component Types Capacitors, resistors, diodes, jumper wire, etc. Component Specs Component Class I Distance Between Tapes 52.4mm +/- 1.5mm (2.063” +/- 0.059”) Pit

smtXtra

Industry News: thermal cycle limit (668)

GPD Global Pushes the Limits for Small Volume Dispensing The new Nano-Piston Pump is now available

Industry News | 2013-10-10 09:56:45.0

GPD Global has again pushed the limits for small-volume dispensing with its new Nano-Piston pump. Dots of conductive adhesive down to 100 μm and solder paste for 01005s are possible with the Nano-Piston Pump.

GPD Global

Altium CAM System and Free ODB++ Viewer Bridge Gap Between PCB Design and Manufacture

Industry News | 2003-03-11 08:45:00.0

CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.

SMTnet

Parts & Supplies: thermal cycle limit (55)

Juki SMT MACHINE GENUINE JUKI SPARE PARTS JUKI YL LIMIT SENSOR ASM 40002068 APM-B3B1-J

Juki SMT MACHINE GENUINE JUKI SPARE PARTS JUKI YL LIMIT SENSOR ASM 40002068 APM-B3B1-J

Parts & Supplies | Sensors

SMT MACHINE GENUINE Juki Spare Parts JUKI YL LIMIT SENSOR ASM 40002068 APM-B3B1-J Specifications: Brand Name JUKI YL LIMIT SENSOR ASM Part number 40002068 Model APM-B3B1-J Ensure Test in machine confirmation Guarantee 1 month usage for m

KingFei SMT Tech

KIC KIC X5 Thermal Profiler with SPC software and RF capability For Reflow

KIC KIC X5 Thermal Profiler with SPC software and RF capability For Reflow

Parts & Supplies | Assembly Accessories

Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,

KingFei SMT Tech

Technical Library: thermal cycle limit (69)

THE EFFECT OF VACUUM REFLOW PROCESSING ON SOLDER JOINT VOIDING AND THERMAL FATIGUE RELIABILITY

Technical Library | 2023-01-17 17:19:44.0

A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.

Heller Industries Inc.

THE LAST WILL AND TESTAMENT OF THE BGA VOID

Technical Library | 2023-01-17 17:22:28.0

The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.

Heller Industries Inc.

Videos: thermal cycle limit (53)

This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

Videos

This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.

Heller Industries Inc.

Job Tracking MES software-Low cost Product and Job Tracking Manufacturing Execution System (MES).

Job Tracking MES software-Low cost Product and Job Tracking Manufacturing Execution System (MES).

Videos

www.unisoft-cim.com/cells.html - CELLS WORKFLOW is affordable, simple to setup & use yet powerful product & job tracking software for fast New Product Introduction (NPI). The CELLS WORKFLOW software provides total traceability in manufacturing floor

UNISOFT Corporation

Training Courses: thermal cycle limit (1)

IPC Designer CID Certification Training Course

Training Courses | | | IPC Designer Certification CID

The Certified IPC Designer CID (Certified Interconnect Designer) course is the industry's premier professional development program for experienced PCB design professionals.

Quadra Solutions Limited

Events Calendar: thermal cycle limit (5)

Joint Chapter Meeting: Photonic Soldering

Events Calendar | Thu May 13 00:00:00 EDT 2021 - Thu May 13 00:00:00 EDT 2021 | ,

Joint Chapter Meeting: Photonic Soldering

Surface Mount Technology Association (SMTA)

Electronics in Harsh Environments Conference - Free Pre-Conference Webinar

Events Calendar | Tue Mar 06 00:00:00 EST 2018 - Tue Mar 06 00:00:00 EST 2018 | ,

Electronics in Harsh Environments Conference - Free Pre-Conference Webinar

Surface Mount Technology Association (SMTA)

Career Center - Jobs: thermal cycle limit (12)

Process Development Engineer

Career Center | , New York USA | Engineering,Research and Development

DESCRIPTION � Responsible for the development and deployment new printed circuit board assembly processes. � Will assume responsibility for Pb-free/RoHS project management & implementation. � Plans, directs, and coordinates manufacturing processes

F-O-R-T-U-N-E Personnel Consultants of Huntsville

Process Development Engineer

Career Center | , Illinois USA | Engineering,Research and Development

DESCRIPTION � Responsible for the development and deployment new printed circuit board assembly processes. � Will assume responsibility for Pb-free/RoHS project management & implementation. � Plans, directs, and coordinates manufacturing processes

F-O-R-T-U-N-E Personnel Consultants of Huntsville

Career Center - Resumes: thermal cycle limit (18)

Staff Process Engineer

Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control

15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience

BankeemChheda-Resume

Career Center | Rochester, New York USA | Engineering

I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research

Express Newsletter: thermal cycle limit (485)

Partner Websites: thermal cycle limit (613)

Partner for Life(cycle): NPI taken to a New Level - Whizz Systems

Whizz Systems | https://www.whizzsystems.com/news/partner-for-lifecycle-npi-taken-to-a-new-level/

Partner for Life(cycle): NPI taken to a New Level - Whizz Systems Skip to content Partner for Life(cycle): NPI taken to a New Level Located in the heart of Silicon Valley, Whizz Systems provides electronics product design, development and manufacturing services

Whizz Systems

The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf

, continuous monitoring during thermal cycling. Thermal cycling was done in accordance with the IPC-9701A guideline [22]. The solder joints were monitored using an event detector set at a resistance limit of 1000 ohms. The failure data are reported as

Heller 公司


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