Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Consultant / Service Provider / Manufacturer
Electronic manufacturing services - electronic design, development and manufacturing. Circuit board design, prototyping, FPGA services, signal integrity and simulation, pcb assembly. Factories in California USA and Malaysia.
New Equipment | Curing Equipment
Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Environmental testing is a very useful tool in ensuring product reliability. We have an environmental laboratory that can assist with every aspect of this testing. Our capabilities begin with test planning with the customer and proceed to execution
Electronics Forum | Wed Mar 19 21:01:49 EST 2003 | Rob
I would suggest creating a special reflow profile, heating the board up to 130C about 50 c below eutectic point (183C). Then applying heat to only the BGA, this will prevent thermal shock to surrounding components.
Electronics Forum | Tue Oct 04 12:49:59 EDT 2005 | patrickbruneel
The amount of times the tin/lead solder can be melted and solidified is unlimited and the heat cycles do not affect the solder characteristics. The only reason for changing the solder pot is when impurities are at or over the maximum levels.
Used SMT Equipment | Soldering Equipment/Fluxes
Versaflow Selective soldering Selective Soldering Process Advantages: Better, Faster, Cleaner & Cheaper! . consistent LF solder joint quality & significant reduction of DPM . No re-melting of top side SMD components, as with wave soldering . PCB
Used SMT Equipment | Repair/Rework
SRT (Sierra Research and Technology) Summit 1100 Automated Workstation Vintage: August 2000 Voltage: 208V Single Phase Includes (2) Computers and (1) Flatscreen Display The Summit 1100 is a semi-automated system for prototyping, light
Industry News | 2003-06-23 08:49:39.0
Three Organizations from the US, Europe and Japan to
Industry News | 2003-05-06 08:21:44.0
Will address key issues in the
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Parts & Supplies | Soldering - Reflow
This reflow oven is top quality oven represent the world's best low cost, high performance solder reflow sytem. The sensor is designed in the front of tip and the temperature induction is very exact and sensitive, the speed of heating and recovery of
Parts & Supplies | SMT Equipment
FUJI CP6 CP642 CP643 CP65 WPH2030 WPH0903 FILTER FUJI CP6 WPA5152 Solenoid valve SPCHA7-25-12-Z3B Square cylinder WPA5152, SPCHA7-25-12-Z3B, CP6/CP643 square cylinder with valve WPA5142; WPH0870 WPH2130 WPH2120 vacuum valve pressure piece XP142
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Events Calendar | Wed Mar 18 00:00:00 EDT 2020 - Wed Mar 18 00:00:00 EDT 2020 | College Park, Maryland USA
CALCE Reliability Science Symposium - Spring 2020
Career Center | Sunnyvale, California USA | Engineering
Our client is a leading equipment supplier to electronic assemblers around the world. Responsibilities: Conduct technical analysis of product implementations, modifications and enhancements to product in accordance with specific customer specifi
Career Center | Charleston, South Carolina USA | Engineering,Maintenance
ELECTRICAL/ELECTRONICS ENGINEER II UEC is looking for an Electrical/Electronics II engineer who is motivated and enthusiastic about joining an engineering group which provides design and development of battery systems, power distribution systems,
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | kerala, any ware India | Production
i have experience in • Operation of wave soldering and water cleaning machine • Inspection ( Reflow and Post Wave ) • Pre Reflow inspection in SMD • Component forming stuffi
SMTnet Express, August 17, 2017, Subscribers: 30,720, Companies: 10,649, Users: 23,665 The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability Richard Coyle, Richard Popowich, Charmaine Johnson - Nokia Bell
Heller Industries Inc. | https://hellerindustries.com/thermal/
Thermal Process Solutions Leader - Heller Home » The Thermal Process Leader Leader in Thermal Process Solutions Focus on Leadership in Thermal Process Solutions for the SMT, Electronics Assembly, Power Device Assembly and Semiconductor Advanced Packaging Industries
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5296
. Data are reported for three distinct thermal cycling profiles, 0/100°C, -40/125°C, and -55/125°C, as characteristic life η (the number of cycles to achieve 63.2% failure) and slope ß
