New Equipment | Rework & Repair Equipment
UNICON-107 - Lead-free soldering station (with safety device) With the world's first safety control sensor (patented). Light weight and easy to use, this is the best-buy of soldering stations. Heater PW: 50W, 70W, and 90W UNICON-107F - Lead-fr
New Equipment | Board Handling - Storage
75lm/W 05): Color: warm white/natural white/cold white 06): CRI:>80 07): Power factor:>0.81 08): Beam angle: 24/30/45Degree 09): Working temp.:-30 degree~60degree 10): Voltage input: 85V~240V AC Advantages: 1): Sufficient power can replace t
Electronics Forum | Tue Feb 26 05:10:17 EST 2008 | adetuc
Thanks for the reply Hege, I calibrate the machines every 3 months and have checked that the board carrier to nozzle parralelism is ok. Have tried many different profile settings using a MOLE for readings but still collapsing on one corner. I did
Electronics Forum | Wed Oct 24 11:14:44 EDT 2001 | Cemal Basaran
Dave; Thanks for responsding so fast. here are my answers. 1-WOW!!! How do people get these cool toys? I am with the University at Buffalo Electronic Packaging Lab. http://www.packaging.buffalo.edu We have pretty much everything that is sold on the
Industry News | 2015-11-25 16:58:05.0
On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.
Industry News | 2011-06-28 15:50:55.0
BTU International announces the addition of Gary Cai as product manager for BTU’s in-line diffusion equipment.
Parts & Supplies | Assembly Accessories
> E9610706000 JUKI REEL PRESSER 72 E64437050A0 JUKI UPPER COVER 12S ASM. ESD18027000 JUKI RAIL E2025700000 JUKI SPACER A E86047170A0 JUKI I/O CONTROLL BOARD JUKI 40046942 DRIVE_PULLEY ESS12023000 JUKI FRAME STOPPER B JUKI 40000906 STO
Parts & Supplies | Component Packaging
SUPPLY ALL JUKI SPARE PARTS AT A LOWER PRICE(10) JUKI L171E2210A0 WA PULLEY BRACKET L UNIT FUJINTAI TECHNOLOGY CO.,LTD JUKI L171E321000 RAIL PLATE RL www.fujintai.com JUKI L171E3210A0 RAIL PLATE PL UNIT FUJINTAI TECHNOLOGY CO.,LTD JUKI L171E521
Technical Library | 2021-12-29 19:52:50.0
Medtronic seeks to quantify the thermal aging limits of electroless Ni-electroless Pd-immersion Au (ENEPIG) surface finishes to determine how aggressive the silicon burn-in process can be without loss of solderability. Silicon burn-in (power testing at elevated temperature) is used to eliminate early field failures, critical for device reliability. Thermal aging due to burn-in or annealing causes Ni and Pd diffusion to and oxidation on the surface. Surface oxides limit wetting of the PbSn solder, affecting electrical connectivity of components soldered afterburn-in. Isothermal aging of two ENEPIG surface finishes was performed at 75°C-150°C for 100 hrs-1500hrs to test the thermal aging limits and identify how loss of solderability occurs.
Technical Library | 2010-07-08 19:49:59.0
Aging characteristics of new lead free solder alloys are in question by many experts because of higher amount of tin’s effect on the diffusion of other metals, primarily copper, to create undesirable boundary intermetallics over long periods of time and even moderately elevated temperatures. A primary layer of intermetallics, Cu6Sn5 forms as the liquid solder makes contact with the solid copper substrate. This reaction however ceases as the solder temperature falls below that of liquidus. A secondary intermetallic Cu3Sn1, an undesirable weak and brittle layer, is thought to form over time and may be accelerated by even mildly elevated temperatures in electronic modules such as laptops under power. This project was designed to quantify the growth rate of Cu3Sn1 over an extended period of time in a thermal environment similar to a laptop in the power on mode.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
