Electronics Forum: thermal pads (Page 1 of 49)

Re-soldering QFP with thermal pads

Electronics Forum | Thu Oct 31 01:52:17 EST 2002 | jason

Anybody with experience on such a rework ?? The QFP has thermal pads underneath the body and needs to be re-connected when subjected for rework... Any ideas ???

Re-soldering QFP with thermal pads

Electronics Forum | Thu Oct 31 09:34:38 EST 2002 | russ

We do this all of the time, This is what we do but I would be interested in other methods. 1. Remove component with BGA type rework station 2. Wick off lead pads only, verify/create even solder surface on the thermal pad on the board 3. Apply no-cle

Power component thermal via

Electronics Forum | Tue Feb 01 04:11:58 EST 2000 | emmanuel

I am to assembly a power SO on the top side of a double side board. My designer has implemented a lot of thermal vias in the heat sink pad of this component. The problem is that i need to prevent the solder cream from polluting the bottom side of the

Solder short-BGA with thermal pad

Electronics Forum | Tue Feb 18 19:07:21 EST 2003 | arturoflores

Our case is not due to thermal pad print squeezing because our shorts are mostly in the outer rows of the BGA so they cannot be caused by central pad printing. We still stick to the BGA thermal pad coplanarity/height hypothesis but have not yet prove

Solder short-BGA with thermal pad

Electronics Forum | Fri Dec 27 09:45:04 EST 2002 | emeto

what exactly do you mean by big thermal pad?

Solder short-BGA with thermal pad

Electronics Forum | Fri Dec 27 10:04:56 EST 2002 | haran

Big pad located at the middle of the package. On the PCB,we need to have solder paste printed on the thermal pad which is at the middle and the other pads of the perimeter BGA.

Solder short-BGA with thermal pad

Electronics Forum | Tue Feb 18 22:15:04 EST 2003 | davef

Arturo, So, you're not shorting to a thermal pad. Given that you're shorting to outer balls, tell us about: * Location of the shorting among the outer balls. * Board construction. * BGA constuction. * Paste deposition. * Temperature measurements ta

Solder short-BGA with thermal pad

Electronics Forum | Fri Dec 27 01:30:13 EST 2002 | haran

Currently we are running a BGA with a big thermal pad in the middle of the package and encountered high defect of solder shorts.I would like to check whether anyone has experience this problem and how this can be rectified?.

Solder short-BGA with thermal pad

Electronics Forum | Wed Feb 19 19:24:12 EST 2003 | arturoflores

Is there any way I can attach a report?

Solder short-BGA with thermal pad

Electronics Forum | Sat Dec 28 02:58:12 EST 2002 | emeto

If the problem is in the big thermal pad.The surface strains in that pad are different then the others and through the reflow period there is an affinity between them(only if they are too close). I recommend you to reduce the theramal pad. Make smal

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