Electronics Forum | Tue Jan 13 22:43:11 EST 2004 | davef
We have seen this in reflowed parts, where there is flux res collected in the dimple in the solder, where the lead 'presses' in the solder. Generally, we attack this as a thermal issue: * Thermal pads sucking the heat away from the leads. * Leads no
Electronics Forum | Tue Sep 23 18:48:57 EDT 2003 | ericsbrown
We have an application where we are applying a heatsink with a thermal tape that has pressure sensitive adhesive (psa) on either side. Does anyone know of an off-the-shelf heatsink press that we could use to apply a consistent, measured force for a
Electronics Forum | Fri Jan 03 15:10:49 EST 2014 | jimmyboz
SET-MANUAL-IO Thermal alarm can be an overload relay, vacuum pump for nozzles or scrap vacuum. It may also be overtemp from the cam box "oil" temp. The 2 overload relays have reset buttons, press and try to feel for a "click". If it is directly t
Electronics Forum | Wed Jun 17 16:02:09 EDT 2009 | mhunter
Any thoughts on this will be appreciated, thanks in advance for reviewing. This assembly has been processed in our facility by going through a press operation (~ 1731 lbs), then into wave solder. Note the discoloration around the pemnut. The discol
Electronics Forum | Wed May 09 17:28:25 EDT 2018 | davef
You can't find a hardness spec for immersion gold [ImAu] because no one cares. The ImAu dissolves into the solder during thermal processing. Pressed, I'd guess for that ImAu hardness is about that of soft gold * Soft: 50-90 knoop * Hard: 130-200 k
Electronics Forum | Mon Feb 23 05:37:23 EST 2009 | emmanueldavid
Necoleta, PWB Blistering/De-lamination may not be due for Titanium finished threads / holders which is typically being used to draw high Shelf Life of Pallets and even flow across Auto Wave Soldering rails. There is also nothing to suspect on Liquid
Electronics Forum | Wed Nov 10 16:19:51 EST 2010 | davef
The 5 thou standoff of your SOIC is probably the minimum. We wouldn't be surprised to see 10 thou. With this, you could have maybe a 6 thou gap between printed solder paste and the bottom of the heat slug. So, you're expecting the rabbit ears of p
Electronics Forum | Wed Jul 27 17:01:14 EDT 2005 | Dreamsniper
Issue: At 60'C test PCB Fails. Operator did simulation. Use of Heat Gun to heat up the BGA to 60'C while PCB is powered and running. At 60'C BGA fails. When pressed system is back which means that something becomes open. Sent BGA for SEM and found t
Electronics Forum | Mon Jan 15 11:21:48 EST 2007 | davef
Contractor mantra: * Profile is good * Boards are bad On profiles, the key question is: where did you take the profile? We�d guess cracked connections are giving the intermittent test results when pressing on the components. You use acoustic micro
Electronics Forum | Tue Jun 01 07:26:55 EDT 2004 | johnwnz
Alistair, your paste deposit is controlled by a few things: Stencil thickness Squeegee pressure Squeegee speed Print gap in 99 out of 100 applications for paste printing you would have a print gap of 0 i.e. on contact printing where the PCB is in fu
