Industry Directory | Consultant / Service Provider
The ThermalAir temperature products are a series of high capacity thermal air stream systems that are used for temperature testing, fast thermal cycling and device temperature characterization of comp
Industry Directory | Distributor
Distributor of electronic components and electromechanical devices
RA300L high frequency circuit materials are ceramic- filled PTFE composites intended for use in commercial microwave and RF applications. This product was designed to offer exceptional electrical and mechanical stability at competitive price. RA300L
New Equipment | Fabrication Services
RF & Microwave PCB's ACI is a leader in providing complex RF/Microwave PCB’s covering a wide spectrum of product types including Defense/Aerospace, Medical Device, Imaging, and Telecommunications Equipment. ACI supports a wide range of frequency ban
Electronics Forum | Sat Jun 11 07:51:15 EDT 2016 | davef
Hi Steve ... There are arguments between fabricators and thermal relievers about adding non-connected copper tabs to barrels in hopes of providing thermal relief, but that's not what you're talking about, I believe. I don't foresee an issue moving t
Electronics Forum | Wed Jun 08 17:35:04 EDT 2016 | slthomas
We all know that whenever possible, we want thermal relief between the barrel/pad and the copper foil to make it easier to properly solder that through hole connector. My question is, assuming there is no connection from the barrel to a copper layer
Used SMT Equipment | In-Circuit Testers
Anritsu MA2472B Anritsu MA2472B Power Sensor 10 MHz to 18 GHz The MA2400A/B Series Power Sensors consist of MA247XA Series Power Sensors, MA246XA/B Series Power Sensors, MA248XA Series Universal Power Sensors, MA242XA/B Series Thermal Power Sen
Industry News | 2003-03-11 08:45:00.0
CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.
Industry News | 2012-05-04 09:21:15.0
As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.
Technical Library | 2010-06-03 22:23:03.0
Strategies for successful design and manufacture of microwave multilayer printed circuit boards. All aspects from pad registration, dimensional stability, impedance fluctuation, fusion bonding, thermal ageing, z-axis expansion, reliability, to Young's mod
Technical Library | 2014-12-04 18:27:40.0
A review on applications of metal-based inkjet inks for printed electronics with a particular focus on inks containing metal nanoparticles, complexes and metallo-organic compounds. The review describes the preparation of such inks and obtaining conductive patterns by using various sintering methods: thermal, photonic, microwave, plasma, electrical, and chemically triggered. Various applications of metal-based inkjet inks (metallization of solar cell, RFID antennas, OLEDs, thin film transistors, electroluminescence devices) are reviewed.
Events Calendar | Wed Apr 26 00:00:00 EDT 2017 - Thu Apr 27 00:00:00 EDT 2017 | Paris, France
2017 RaMP Workshop and Tabletop Exhibition
International Microelectronics Assembly and Packaging Society (IMAPS)
Events Calendar | Wed Aug 16 00:00:00 EDT 2017 - Sat Aug 19 00:00:00 EDT 2017 | Harbin, China
ICEPT 2017, The 18th International Conference on Electronic Packaging Technology
SMTnet Express, May 7, 2020, Subscribers: 36,108, Companies: 11,001, Users: 25,793 Solutions for Selective Soldering of High Thermal Mass and Fine-Pitch Components Credits: Nordson SELECT The selective soldering process has evolved to become a
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/thermal-compounds?con=t&page=24
Thermal Interface Materials (TIM) | Thermal Compound | Nordson EFD Nordson EFD Corporate | Global Directory | Languages Division Only All of Nordson Home Products Accessories
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_07_15_09.pdf
. 8 Component Stress Relief #2 Solder in the lead bend area of a lead attached to a terminal, does it affect the Stress relief requirements of the component
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