Manufactures a wide range of environmental test solutions capable of temperature and humidity cycling, thermal shock, production stress screening, accelerated stress testing, combined environment testing, controlled humidity exposure.
Industry Directory | Consultant / Service Provider
Micom Laboratories Inc.’s test offering includes: UV testing, corrosion, temperature & humidity cycling, Thermal shock, Material testing, Package, Coating testing. We are ISO 17025 accredited.
Environmental testing is a very useful tool in ensuring product reliability. We have an environmental laboratory that can assist with every aspect of this testing. Our capabilities begin with test planning with the customer and proceed to execution
New Equipment | Design Services
With our well-equipped environmental and test laboratories, we can assist customers in developing and validating reliability models to simulate product lifetimes and field failures for their products. ACI utilizes Environmental Stress Screening (ESS
Electronics Forum | Tue Dec 30 20:48:31 EST 1997 | Tom Gervascio
Has anyone had any experience with thermal shocking and cracking of SMD capacitors during the rework process? My company was advised to preheat capacitors to 125 C at a rate of 2 C/sec before replacing them onto boards. Would this maybe degrade c
Electronics Forum | Fri Jun 06 06:11:18 EDT 2014 | paulg
I have a large monoblock ceramic filter on a PTFE based pcb material. The filter has a metal casing soldered onto the ceramic filter. I am concerned that if the heating rate is to rapid, then thermal shock / differential expansion could cause the fil
Used SMT Equipment | General Purpose Equipment
Tenney - Blue M Thermal Shock Chamber For Sale See attached pictures and information below Equipment Information Tenney - Blue M - TPS Model Number: WSP-109 Serial Number: 0801000082 Year: 2007 Type: Hot Cold - Shock
Used SMT Equipment | General Purpose Test & Measurement
Very Nice Thermotron Thermal Shock Chamber For Sale See attached pictures and information below Thermotron Model Number: ATS-320-V-10-705 Serial Number: 44470 Year: 2013 Type: Shock Chamber - Hot/Cold -73 to 177C Hot Zone 60 to 200C 8800
Industry News | 2020-01-07 11:09:15.0
IPC-8921 establishes classifications and designations for woven and knitted e-textiles integrated with e-fibers, e-yarns and e-wires. It also standardizes key characteristics and durability testing for these materials as well as the industry test methods to be used to test against those characteristics.
Industry News | 2016-11-30 14:47:45.0
ACI Technologies invites you to download a free copy of its very popular e-booklet, “Failure Analysis Techniques for Electronics” from its Website store, which is located at http://store.aciusa.org/Failure-Analysis-Techniques-for-Electronics-Digital-Download-P181.aspx
Parts & Supplies | Chipshooters / Chip Mounters
> JUKI ESL13000000 VACUUM PAD 15 JUKI ESL13000100 PHOTO MICRO SENSOR A JUKI ESL13001000 TUBE union (KL700) JUKI ESL130011A0 CONVEYOR MOTOR (KZ500) JUKI ESL13002000 CLAMP LEVER JUKI ESL13003000 T TYPE NUT JUKI ESL130031A0 OPERATION PANEL (KL700) JUKI
Parts & Supplies | Assembly Accessories
> JUKI ESL13000000 VACUUM PAD 15 JUKI ESL13000100 PHOTO MICRO SENSOR A JUKI ESL13001000 TUBE union (KL700) JUKI ESL130011A0 CONVEYOR MOTOR (KZ500) JUKI ESL13002000 CLAMP LEVER JUKI ESL13003000 T TYPE NUT JUKI ESL130031A0 OPERATION PANEL (KL700
Technical Library | 2007-02-01 09:27:47.0
The purpose of the testing was to compare the resistance and check for open circuit conditions of reworked BGA test samples made with and without StencilQuik™ after 500 thermal shock cycles. StencilQuick™ is a product of Best Inc. In this series of tests, the resistance of daisy chain resistance patterns running between the BGA and test board after exposure to thermal shock was measured.
Technical Library | 2019-11-12 02:09:22.0
Thermal shock test chamber can be used for testing the chemical change or physical damage on composite materials caused by the thermal expansion and contraction of the sample in the shortest time,which is subjected to extremely and continuous high and low temperature environment.so how to check the temperature recovery time of this chamber? Normally we take following steps to inspect the temepratuire recovering time: 1.Install the temperature sensor at the specified position, and adjust the temperature controller of hot zone and cold zone to the required nominal temperature respectively. 2.The temperature increases and reduces respectively,30min after temperature in two zones reach stable status,record temperature value of the measuring point,pls set the temperature value of two zones to be required nominal temperature. 3.The temperature shock test chamber automatically places the inspected load into theh ot zone,select the corresponding retention time according to regulated standard. 4.Set the transfer time,then the inspection load is transferred from hot zone to cold zone, and the temperature of the measuring point is observed and recorded, and then the reverse conversion of the load from cold zone to hot zone is carried out according to the same method, and the temperature of the measuring point is observed and recorded. www.climatechambers.com
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Events Calendar | Mon Sep 14 00:00:00 EDT 2020 - Mon Sep 14 00:00:00 EDT 2020 | ,
Printed Circuit Board (PCB) Inspection & Quality Control
Events Calendar | Wed Oct 20 00:00:00 EDT 2021 - Wed Oct 20 00:00:00 EDT 2021 | ,
Penang Chapter Virtual Vendor & Technical Day
Career Center | , Massachusetts | Engineering
we are looking for a mechanical engineer with the following qualifications: * BSME * US Citizenship * Pro-Engineer / Pro-Mechanica experience * Military electronics packaging background * Thermal and Structural Analysis (Shock, Vibe) analys
Career Center | Rochester, New York USA | Engineering
Our high tech client located in the Western NY State area offers you the following challenge. Complete mechanical design responsibility from specification to the manufacturing process. We seek a candidate that has the following experience: Design
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | Fort Mill, South Carolina USA | Engineering,Maintenance,Research and Development
Have serviced AMF pinspotters both mechanical and electrical sides; included repair of chassis pc boards to component level. 20 years in this field. Have worked in PCB manufacture with old style board populators and Panasert robots Worked in H
SMTnet Express, January 2, 2014, Subscribers: 26448, Members: Companies: 13543, Users: 35577 Thermal Shock and Drop Test Performance of Lead-free Assemblies with No-Underfill and Corner-Underfill by Bankeem Chheda, S. Manian Ramkumar, Ph
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/footprints-for-high-vibration-and-shock_topic2568_post10485.html
:46am Hi Everyone, I was wondering if there are any standards or guidelines for designing footprints to withstand mechanical shocks and vibration
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smt
. For applications where the BGA may be subjected to regular shocks (for example in a mobile phone) mechanical pull and shear testing ensures adhesion strength is acceptable and protects against future latent failures. More information